Manufacturing method of PTH half hole of PCB

Abstract

The embodiment of the invention provides a method for manufacturing a PTH half hole of a PCB, and the method comprises the steps: taking a semi-finished PCB, setting milling cutter parameters by taking a boundary between a PTH hole reservation region and a PTH hole removal region as a reference line, carrying out the primary milling of a PTH hole, and enabling a cutter entering point of a milling cutter located on a first side hole wall of the PTH hole to be away from the reference line by a first preset distance, moving the cutter along the datum line until the orthographic projection of the axis of the milling cutter on the datum line is a second preset distance away from the intersection point of a second side hole wall opposite to the first side hole wall on the PTH hole and the datum line, rotating the cutter to move along the datum line until the milling cutter moves out of the PTH hole by a third preset distance, and turning over the upper and lower plate surfaces to carry out secondary milling treatment on the PCB, and the milling cutter moves from the outer side of the second side hole wall along the datum line until the milling cutter moves out of the PTH through the first side hole wall, and the milling cutter rotates from the inside to the outside of the hole at the first side hole wall and the second side hole wall. According to the embodiment of the invention, the high-quality PTH half hole is obtained by scientifically setting the distance position of the cutter feeding point relative to the reference line and the rotation direction of the milling cutter.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of PCB board processing, and in particular, to a method for manufacturing a PTH half hole of a PCB board. Background technique [0002] In the PTH half-hole manufacturing process of the existing PCB board, after the PTH half-hole is formed, the hole wall is prone to the phenomenon of residual copper wire with burrs on the hole wall. The common method is to drill the PTH half hole for a second time, then perform a second dry film film, and finally remove the burr by etching again. This method requires three additional processing steps in the PTH half hole process, which improves the processing. In addition, the side etching is easy to cause the copper skin defect of the PTH half-hole hole wall again during etching, which leads to the phenomenon of weak solder joints and virtual soldering in the subsequent welding process. SUMMARY OF THE INVENTION [0003] The technical problem to be s...

AI Technical Summary

Problems solved by technology

[0002] In the PTH half-hole manufacturing process of the existing PCB board, after the PTH half-hole is formed, the hole wall is prone to residual burrs and copper wires on the hole wall. If the burrs are not removed cleanly, it may even cause a short circuit

A common method is to drill the PTH half hole twice, then dry the film a second time, and finally etch again to remove the burr. This method needs to add three additional processing steps in the PTH half hole process, which improves the processing. time and cost; and it is easy to cause side erosion during etching to cause the copper defect of the PTH half-hole wall again, resulting in weak solder joints and virtual soldering in the subsequent welding process

Images