Full-automatic chip testing machine

A chip testing, fully automatic technology, applied in electronic circuit testing, conveyors, mechanical conveyors, etc., can solve problems such as increasing production costs, reducing production efficiency, increasing workload, etc., to improve accuracy, efficiency, and automation. high degree of effect

Active Publication Date: 2022-07-01
GUANGDONG DONGBO AUTOMATION EQUIP CO LTD
View PDF14 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the chip automatic test assembly line has been widely used, but in other links, such as chip loading, unloading, and material transfer, manual further processing is required, which increases the workload, reduces production efficiency, and affects production capacity. also increased production costs

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Full-automatic chip testing machine
  • Full-automatic chip testing machine
  • Full-automatic chip testing machine

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention.

[0031]It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative relationship between various components under a certain posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly.

[0032] In addition, the descriptions involving "first", "second", e...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a full-automatic chip testing machine which comprises a first machine table, a second machine table and a third machine table, the second machine table and the third machine table are arranged in parallel, the second machine table and the third machine table are vertically connected to the first machine table, mounting supports are arranged on the second machine table and the third machine table, a plurality of testing mechanism mounting layers are arranged on the mounting supports, and the testing mechanism mounting layers are arranged on the testing mechanism mounting layers. A plurality of testing mechanisms are arranged on each testing mechanism mounting layer at intervals, and transfer feeding and transplanting manipulators are arranged on the corresponding sides of the second machine table and the third machine table. According to the invention, a full-automatic test mode of batch chips is adopted, a plurality of chips can be tested at the same time, and the test efficiency is improved. The test mechanism can realize the function test of the chip in a high and low temperature environment, and the test accuracy is improved. According to the automatic sorting device, qualified products and NG products can be sorted and respectively loaded on the NG product tray and the OK product tray to be collected, then the trays filled with chips can be carried out, and empty trays are supplemented to corresponding conveying lines.

Description

technical field [0001] The invention relates to chip testing equipment, in particular to an automatic chip testing machine. Background technique [0002] With the transformation of the production process, more and more automated equipment has been put into production line operations to replace manual simple and repetitive assembly line operations, thereby reducing labor costs, improving productivity and corporate competitiveness. [0003] At present, the chip automatic test line has been widely used, but in other links, such as chip loading, unloading, transfer, etc., further processing needs to be done manually, which increases the workload, reduces production efficiency, affects production capacity, and at the same time Also increases the production cost. SUMMARY OF THE INVENTION [0004] In order to overcome the shortcomings and deficiencies in the prior art, the purpose of the present invention is to provide a fully automatic chip testing machine. [0005] The purpos...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28B65G47/91B65G47/74B65G37/02B07C5/36
CPCG01R31/2834G01R31/2893B65G47/914B65G47/74B65G37/02B07C5/362
Inventor 杨应军董洪斌成灿蔡创坤鲁建红陈伯乐
Owner GUANGDONG DONGBO AUTOMATION EQUIP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap