Method for detecting wafer of virtual interaction equipment

A technology of virtual interaction and detection method, which is applied in image analysis, instrumentation, computing, etc., can solve the problem that automatic detection equipment cannot meet the automatic detection of wafers with irregularly arranged chips, and achieves easy detection standard control and high economic value. , the effect of reducing the risk of damage

Pending Publication Date: 2022-07-01
苏州康钛检测科技有限公司
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Problems solved by technology

[0007] The purpose of the present invention is to solve the above-mentioned deficiencies in the prior art, aiming at the problem that automatic detection equipment cannot meet the automatic detection of wafers with irregularly arranged chips, and proposes a detection method for virtual interactive equipment wafers

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  • Method for detecting wafer of virtual interaction equipment
  • Method for detecting wafer of virtual interaction equipment
  • Method for detecting wafer of virtual interaction equipment

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[0031] In order to make the purposes, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments These are some embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0032] The present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the related invention, but not to limit the invention. In addition, it should be noted that, for the co...

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Abstract

The invention discloses a virtual interaction device wafer detection method, which comprises a visual detection device, the visual detection device comprises a wafer carrier, an image acquisition unit, a comprehensive driving adjustment unit, an image comparison database and a comparison analysis unit, and the method comprises the following steps: importing wafer chip position data into the comprehensive driving adjustment unit; driving to realize phase switching alignment adjustment of the image acquisition unit and any chip on the wafer; and performing image acquisition, comparison and analysis on each chip, and then generating a defect distribution diagram. According to the invention, the automatic detection requirement of irregular chip arrangement wafers is met, image acquisition station switching is realized through wafer chip position data, and respective acquisition and detection of all chip images are realized. A defect distribution diagram can be generated, physical marking is not needed, the risk of wafer pollution and damage is reduced, and meanwhile intelligent recognition can be easily carried out in a back-end process. The detection efficiency and the detection precision are greatly improved, meanwhile, detection standard control is easy to achieve, and high economic value is achieved.

Description

technical field [0001] The invention relates to a method for detecting a virtual interactive device wafer, and belongs to the technical field of wafer detection with irregularly arranged chips in an AR / VR virtual interactive device. Background technique [0002] Wafer refers to the silicon wafer used in the manufacture of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer; it can be processed into various circuit element structures on the silicon wafer, and become an IC with specific electrical functions. product. The original material of the wafer is silicon, and the surface of the earth's crust has an inexhaustible amount of silicon dioxide. Silica ore is refined in an electric arc furnace, chlorinated with hydrochloric acid, and distilled to produce high-purity polysilicon. [0003] The traditional distribution of chips on a wafer is a matrix-like regular distribution, but during wafer inspection, it is only necessary to align...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06T7/00
CPCG06T7/0004G06T2207/30148
Inventor 顾振鹏凌栋茅志敏
Owner 苏州康钛检测科技有限公司
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