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Packaging material for LED packaging and LED

A technology of LED packaging and packaging materials, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve problems such as LED glue cracking and dead lights, and achieve the effects of prolonging service life, reducing water vapor, and solving LED glue cracking

Pending Publication Date: 2022-07-01
HUIZHOU VISION NEW TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of the above deficiencies in the prior art, the purpose of the present invention is to provide a packaging material for LED packaging and LEDs, aiming to solve the problems of existing LED glue cracks and dead lights

Method used

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  • Packaging material for LED packaging and LED
  • Packaging material for LED packaging and LED
  • Packaging material for LED packaging and LED

Examples

Experimental program
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Effect test

Embodiment

[0043] The model of lamp beads used in the LED package is 3030, the refractive index of silica gel is 1.545, the model is BQ-4158, the dispersant used is sodium hexametaphosphate, and the mass ratio of sodium hexametaphosphate to silica gel is 1%. Powder is SiO 2 E8000, the particle size is 3-5nm; the mass ratio of glass powder to silica gel is 5%, 10%, 15%, 20%, 25%, 30%, 35%, 40% of the packaging materials. When the concentration increases, it cannot be leveled after centrifugation, has no fluidity, and cannot complete the LED packaging. At the same time, too much glass powder will also affect the adhesive force and fluidity of the glue, so 40% is the highest concentration that can be achieved. Through dispensing, centrifugation and other processes, the sample is evenly coated on the chip.

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Abstract

The invention discloses a packaging material for LED packaging and an LED. The packaging material comprises a packaging adhesive and glass powder dispersed in the packaging adhesive. Because the glass powder has excellent stability, reinforcing property, sealing property, wear resistance and the like, when the packaging material dispersed with the glass powder is packaged on the surface of a chip in an LED, water vapor and oxygen entering the chip in the LED can be reduced, so that the problems of glue crack and lamp failure of the chip in the LED are solved, the chip in the LED is fully protected, and the service life of the LED is prolonged. And the service life of the LED is prolonged.

Description

technical field [0001] The invention relates to the field of LEDs, in particular to a packaging material for LED packaging and an LED. Background technique [0002] As a backlight source, LED has the advantages of long life, high luminous efficiency, high brightness, and short response time, and is widely used in the TV industry. The encapsulant in the LED composition has the advantages of high refractive index and high light transmittance. It can increase the luminous flux of the LED and block most of the water vapor and oxygen from entering the chip, thereby playing the role of waterproof, moisture-proof, heat dissipation, and sealing, increasing the number of LEDs. reliability and durability. Common encapsulants include epoxy encapsulant, silicone encapsulant, polyurethane encapsulant and ultraviolet curing encapsulant, etc., but the molecular gap of encapsulant is large. The increase in temperature causes the thermal motion of the molecules to accelerate, making it eas...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/56H01L33/48
CPCH01L33/56H01L33/48
Inventor 付文静李泽龙严方红
Owner HUIZHOU VISION NEW TECH CO LTD
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