Copper-clad plate processing equipment

Abstract

The copper-clad plate processing equipment comprises a rack, a front side plate and a rear side plate are arranged at the positions, close to the right side, of the upper end of the rack, a transverse plate is arranged between the front side plate and the rear side plate, and a right side plate extending downwards is arranged on the right side of the transverse plate; a shaft rod is connected into the transverse plate in a sliding mode in the vertical direction, a cutter plate is arranged at the lower end of the shaft rod, a cutter is arranged at the lower end of the cutter plate, and a cutter groove is formed in the portion, under the cutter, in the rack. A pressing sleeve assembly is arranged on the front side of the right side plate. The outer side, extending out of the transverse plate, of the shaft rod is provided with a convex edge, and the shaft rod is sleeved with a first spring located between the convex edge and the transverse plate. A driving assembly is arranged between the front side plate and the rear side plate; a feeding assembly is arranged on the left side of the pressing sleeve assembly in the rack, and the feeding assembly is used for intermittently conveying the copper-clad plate from left to right; the feeding assembly comprises a clamping assembly; the copper-clad plate processing equipment is simple in structure and high in cutting processing efficiency.

Description

technical field [0001] The invention relates to the technical field of copper clad laminates, in particular to a copper clad laminate processing equipment. Background technique [0002] Copper clad laminate is a kind of plate-like material made by impregnating electronic glass fiber cloth or other reinforcing materials with resin, covering one or both sides with copper foil and hot pressing, which is referred to as copper clad laminate for short. CCL is mainly used in the manufacture of printed circuit boards, and is widely used in mobile phones, computers, televisions and other fields. At present, the following problems still exist in the process of processing CCL: [0003] (1) Since the copper clad laminate needs to be cut to an appropriate size when it is processed and formed, the current cutting equipment will cause the copper clad laminate to warp after cutting, which will affect the subsequent processing and use of the copper clad laminate; [0004] (2) The existing e...

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Problems solved by technology

[0003] (1) Since the copper clad laminate needs to be cut into an appropriate size when it is processed and formed, but the current cutting equipment will cause the copper clad laminate to warp after cutting, which will affect the subsequent processing and use of the copper clad laminate;

[0004] (2) The existing equipment needs to continuously complete the feeding and cutting action when cutting the copper clad laminate, so that the copper clad laminate can be cut into the same size. Judging the position of the copper clad laminate, and then cutting, this method is not only slow, but also expensive

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