Damping structure of power amplifier for communication

A power amplifier and amplifier technology, which is applied to amplifiers, parts of amplifiers, springs/shock absorbers, etc., can solve problems such as affecting the efficiency of power amplifiers, and reduce the impact, the amplitude of sloshing, and the amplitude of vibration. Effect

Active Publication Date: 2022-07-08
北京澳丰源科技股份有限公司
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Problems solved by technology

[0004] In view of the above-mentioned related technologies, the inventor believes that the operator can install the power amplifier on the device through the mounting plate. When the device itself vibrates due to the influence of the external environment, the vibration of the device itself can be directly transmitted to the power amplifier through the mounting plate, which is easy to affect Power Amplifier Efficiency

Method used

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  • Damping structure of power amplifier for communication
  • Damping structure of power amplifier for communication
  • Damping structure of power amplifier for communication

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Embodiment Construction

[0035] Attached to the following Figure 1-6 This application will be described in further detail.

[0036] The embodiment of the present application discloses a shock absorption structure of a power amplifier for communication. refer to figure 1 , the shock absorption structure of the power amplifier for communication includes a base plate 1 , a mounting plate 2 and an amplifier body 3 .

[0037] refer to figure 1 , figure 2 , the base plate 1 is installed on the device that needs to install the amplifier body 3, the upper surface of the base plate 1 is provided with a dovetail groove 12, there are two dovetail grooves 12, and the two dovetail grooves 12 are arranged at intervals. A dovetail block 11 is provided on the upper surface of the bottom plate 1 , the dovetail block 11 is slidingly matched with the inner side wall of the dovetail groove 12 , and there are two dovetail blocks 11 in a single dovetail groove 12 . The dovetail block 11 is provided with a connecting...

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Abstract

The invention discloses a damping structure of a power amplifier for communication, and belongs to the field of wireless communication power amplifiers, the damping structure comprises a bottom plate, a mounting plate arranged on the bottom plate and an amplifier body mounted on the mounting plate, and a dovetail block is slidably arranged on the bottom plate in the length direction of the bottom plate; a dovetail groove used for being in sliding fit with a dovetail block is formed in the bottom plate, connecting rods are hinged to the dovetail block, the ends, away from the dovetail block, of the connecting rods are hinged to the bottom of the mounting plate, the adjacent connecting rods are arranged in a crossed mode, a first spring is fixedly connected to the dovetail block, and a second spring is fixedly connected to the dovetail block. The end, away from the dovetail block, of the first spring is fixedly connected with the inner side wall of the dovetail groove. The power amplifier has the effect of reducing the influence of vibration on the power amplifier body.

Description

technical field [0001] The present application relates to the technical field of wireless communication power amplifiers, and in particular, to a shock absorption structure for communication power amplifiers. Background technique [0002] An amplifier is a device that can amplify or amplify the voltage of an input signal, consisting of tubes or transistors, and other electrical components. Amplifiers are used in various devices such as communications and radar. Amplifiers are important components for signal processing. [0003] In the related art, the Chinese utility model patent with the publication number CN207083063U discloses a power amplifier, which includes a casing, the upper end of the casing is provided with a terminal and an audio access port, the audio access port and the terminal are respectively provided with a cap, and the front of the casing is provided with a cap. The side and rear sides are provided with cooling fins, the casing includes a bottom plate, the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F16F15/067F16M11/04H03F1/00
CPCF16F15/067F16M11/04H03F1/00Y02D30/70
Inventor 姚建海吕小光
Owner 北京澳丰源科技股份有限公司
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