Printed circuit board (PCB) with high heat dissipation structure and processing method thereof

Abstract

The invention discloses a PCB with a high heat dissipation structure and a processing method thereof, the PCB comprises a core plate, a metal substrate and prepregs, the core plate and the metal substrate are in press fit connection through the prepregs, the core plate is provided with a plurality of first heat dissipation areas used for placing high-power components, the first heat dissipation areas are provided with a plurality of first heat dissipation holes, and the first heat dissipation holes are used for placing the high-power components. The first heat dissipation holes are connected through heat transfer wires, hole copper is arranged on the hole walls of the first heat dissipation holes, and the core plate and the metal substrate are selected according to the heat dissipation requirement of the high-power component; after the core plate and the metal substrate are manufactured, the core plate and the metal substrate are in press fit connection through the prepregs, through the design of the first heat dissipation area, the first heat dissipation holes and the filler in the holes, the heat dissipation requirement can be met, the heat dissipation requirement of a product cannot be far beyond the heat dissipation requirement of the product, and the phenomena of too high cost and resource waste are avoided.

Description

technical field [0001] The invention relates to the technical field of PCB boards, in particular to a PCB board with a high heat dissipation structure and a processing method thereof. Background technique [0002] With the continuous development of electronic devices towards intelligence, miniaturization and portability, the power density of electronic devices is increasing. Converted into heat, this heat causes the internal temperature of the component to rise rapidly. If the heat is not dissipated in time, the continuous heating of the electronic component will lead to a decline in quality, or even failure due to overheating. [0003] For electronic components with large heat generation, it is necessary to carry out corresponding heat dissipation design, such as using metal substrates to make circuit boards, welding metal substrates on circuit boards, etc., but the above methods have the disadvantages of large consumption of metal materials, high cost, complicated manufact...

AI Technical Summary

Problems solved by technology

[0002] With the continuous development of electronic devices towards intelligence, miniaturization and portability, the power density of electronic devices is increasing, especially when high-power electronic devices work Most of the consumed electric energy is converted into heat except for some useful work. This heat causes the internal temperature of the components to rise rapidly. If the heat is not dissipated in time, the continuous heating of electronic components will lead to quality degradation, or even failure due to overheating.

[0003] For electronic components with large heat generation, corresponding heat dissipation design is required, such as using metal substrates to make circuit boards, welding metal substrates on circuit boards, etc., but the above methods exist Disadvantages of large consumption of metal materials, high cost, complicated manufacturing process, and bulky products

In addition, in the heat dissipation design, the calorific value of high-power electronic devices during normal operation is not considered, and some materials with suitable thermal conductivity of the circuit board are selected, and the heat dissipation design is accurately optimized through calculation, resulting in material selection and wiring design that cannot meet the heat dissipation requirements or far exceed them. Product requirements, resulting in high cost and unable to promote application

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