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Wafer cleaning assembly, cleaning device and cleaning method

A technology for cleaning devices and wafers, applied in cleaning methods and utensils, cleaning methods using liquids, chemical instruments and methods, etc., can solve the problems of incomplete wafer cleaning and poor liquid fluidity, etc. Clean and improve the effect of cleaning

Pending Publication Date: 2022-07-22
四川上特科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this cleaning method of immersing wafers, the cleaning of the wafers is not thorough due to the poor fluidity of the liquid in the cleaning tank.

Method used

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  • Wafer cleaning assembly, cleaning device and cleaning method
  • Wafer cleaning assembly, cleaning device and cleaning method
  • Wafer cleaning assembly, cleaning device and cleaning method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 2

[0055] like Figure 4 As shown, this embodiment provides a wafer cleaning device, including a clamping assembly 6 , a transfer mechanism 5 , and the wafer cleaning assembly in the first embodiment.

[0056]Specifically, the transfer mechanism 5 is located at the outer end of the cleaning tank 1, and is used to transfer the clamping assembly 6 to the cleaning tank 1 or from the cleaning tank 1. The clamping assembly 6 is connected to the transfer mechanism 5 and used to clamp several crystals. The wafer 4 is placed into the cleaning tank 2 or taken out from the cleaning tank 2 .

[0057] More specifically, as Figure 5~Figure 8 As shown, the transfer mechanism 5 includes a rotating assembly 51, a translation plate 52, a moving frame 53 and two worms 54 arranged side by side, such as Figure 10 As shown, the rotating assembly 51 sequentially includes a gear 513, a connecting rod 512 and a worm wheel 511 from top to bottom, the worm 54 is arranged in the left-right direction, b...

Embodiment 3

[0067] This embodiment provides a wafer cleaning method, using the wafer cleaning device in Embodiment 2, including the following steps:

[0068] S1, preparation stage

[0069] The worm gear 511 is located at the rightmost end of the transfer mechanism 5 , and when the gear 513 is close to the front end of the moving frame 53 , this is the initial state, and the flexible clamping jaws 62 are used to hold the wafer 4 to be cleaned.

[0070] S2, transfer stage

[0071] Rotating the motor 56 makes the two worms 54 rotate clockwise in the same direction at the same time, so that the translation plate 52, the moving frame 53, the horizontal support rod 533, and the clamping assembly 6 translate together in the direction of the cleaning pool 1, and stop when they reach the preset position.

[0072] S3, cleaning stage

[0073] The lift rod 61 starts to descend, insert the wafer 4 into the wafer card slot 23 of the cleaning tank 2, the flexible clamping jaw 62 deflates to release th...

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PUM

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Abstract

The invention discloses a wafer cleaning assembly, a cleaning device and a cleaning method, and the cleaning assembly is used for cleaning a wafer and comprises a cleaning pool, a cleaning tank and a plurality of water nozzles. The left and right ends of the cleaning tank are connected to the inner wall of the cleaning pool, and the bottom of the cleaning tank is suspended and opened; the water sprayers are disc-shaped and connected with water pipes, water spraying holes are formed in the two faces of each water sprayer, sprayer clamping grooves and wafer clamping grooves are formed in the cleaning tank at intervals, and the water sprayers are sequentially arranged in the sprayer clamping grooves; and a plurality of wafers are sequentially arranged in the wafer clamping grooves. According to the wafer cleaning device, soaking type cleaning is changed into spraying type cleaning, each wafer can be cleaned, sewage can quickly flow away conveniently, and the cleaning effect and cleaning efficiency of the wafers can be greatly improved.

Description

technical field [0001] The present invention relates to the technical field of semiconductor processing, in particular to a wafer cleaning component, a cleaning device and a cleaning method. Background technique [0002] Wafers refer to silicon wafers used to make silicon semiconductor integrated circuits. Because the cleanliness of the wafer surface will greatly affect the yield and performance of the final product, it is necessary to ensure that the wafer surface is very clean during the processing of the wafer. In the prior art, a common practice is to place a number of wafers to be cleaned in a storage basket, then soak the storage basket in a cleaning pool, and move the storage basket up and down repeatedly to complete the wafer cleaning. However, in this cleaning method of soaking wafers, because of the poor fluidity of the liquid in the cleaning pool, the wafers are not cleaned thoroughly. SUMMARY OF THE INVENTION [0003] In order to solve the deficiencies of the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B3/02B08B13/00H01L21/67
CPCB08B3/022B08B13/00H01L21/67051
Inventor 胡仲波冯永李健儿蒋红全周建余
Owner 四川上特科技有限公司