Photoelectric probe assembly
A probe and photoelectric technology, applied in the direction of measuring electricity, measuring electrical variables, electronic circuit testing, etc., can solve the problem of low detection efficiency of chip optical performance and electrical performance, and achieve the effect of improving test efficiency
Active Publication Date: 2022-07-22
STELIGHT INSTR CO LTD
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Problems solved by technology
[0004] Another purpose of the first aspect of the present invention is to solve the problem of low detection efficiency for the optical performance and electrical performance of the chip in the prior art
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Embodiment Construction
[0032] As a specific embodiment of the present invention, as Figure 1-5 As shown, this embodiment provides a photoelectric probe assembly 100 . The photoelectric probe assembly 100 can be used to test the optical and electrical signals of the chip to be tested. The photoprobe assembly 100 may include a photoprobe body 10 . The photoelectric probe body 10 may include an optical fiber core layer 11 , an optical fiber cladding layer 12 and a first conductive layer 13 . The optical fiber cladding layer 12 is wrapped outside the optical fiber core layer 11 . The first conductive layer 13 is wrapped around the fiber cladding layer 12 and serves as an electrical interface end. The photoelectric probe body 10 includes a first end portion 14 and a second end portion 15. At the first end portion 14, the optical fiber core layer 11, the optical fiber cladding layer 12 and the first conductive layer 13 are coaxially arranged to serve as external light interface side. At the second e...
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The invention provides a photoelectric probe assembly, and relates to the technical field of semiconductor detection. The photoelectric probe assembly comprises a photoelectric probe body, and the photoelectric probe body comprises an optical fiber core layer; the optical fiber cladding is wrapped outside the optical fiber core layer; the first conductive layer is wrapped outside the optical fiber cladding and is used as an electrical interface end; wherein the photoelectric probe body comprises a first end part and a second end part, and at the first end part, the optical fiber core layer, the optical fiber cladding and the first conductive layer are coaxially arranged to serve as an external optical interface end; and at the second end part, the first conductive layer wraps the optical fiber cladding to serve as an electrical test end, and the optical fiber core layer penetrates through the optical fiber cladding and the first conductive layer at a position away from the second end part by a preset distance to be exposed at the outer side wall of the first conductive layer to serve as an optical test end. According to the photoelectric probe assembly, the optical probe and the electric probe are integrated in the same instrument, and electric signals and optical signals of a chip are detected at the same time.
Description
technical field [0001] The invention relates to the technical field of semiconductor detection, in particular to a photoelectric probe assembly. Background technique [0002] The existing chips integrate optical devices and electrical devices. Among them, optical devices generally include coupling gratings, optical waveguides, photodetectors, optical modulators, etc., while electrical devices generally include laser drivers, controllers, Amplifiers, modulator drivers, clock signals, communication interfaces, etc. When a chip containing an optical device and an electrical device is produced, its optical performance and electrical performance need to be tested in order to ensure that the device can be used normally when it leaves the factory. The traditional detection of chips is to use optical probes and electrical probes to test the optical properties and electrical properties of the chips, respectively. In this case, two probe instruments need to be used, and because the ...
Claims
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IPC IPC(8): G01R1/067G01R31/28G01M11/02
CPCG01R1/06733G01R31/2886G01M11/0207
Inventor 徐鹏嵩黄建军赵山
Owner STELIGHT INSTR CO LTD