Semiconductor electronic component detection device and method

Abstract

The invention provides a semiconductor electronic component detection device and method, and relates to the technical field of test equipment, and the device comprises a detection platform, a pressing test mechanism, and at least one movable pressing rod mechanism. The movable pressing rod mechanism is installed on the detection platform and used for transferring and pressing the electronic element, the movable pressing rod mechanism is provided with a pressed surface and a first pressurizing surface used for pressing the electronic element, and the first pressurizing surface is located under the pressed surface; the downward pressing testing mechanism is installed on the detection platform and reciprocates relative to the detection platform, the downward pressing testing mechanism is provided with a second pressurizing face, the downward pressing testing mechanism is used for applying downward pressure to the pressed face of the movable pressing rod mechanism through the second pressurizing face, and the pressure on the movable pressing rod mechanism is transmitted in the direction from the pressed face to the first pressurizing face. The semiconductor electronic component detection device provided by the invention can be suitable for a high-speed operation test environment, and the movable pressing rod mechanism is not subjected to a bending moment load, so that the problem of low test yield caused by non-uniform test pressure is effectively relieved.

Description

technical field [0001] The present invention relates to the technical field of testing equipment, in particular to a semiconductor electronic component testing device and method. Background technique [0002] With the increasing complexity of IC (Integrated Circuit Chip, micro electronic components) functional modules, the test pressure and test time of ICs are gradually increasing. With the increase, the overall test cost will be reduced accordingly, so the demand for multi-station large pressure testing machines came into being. [0003] The traditional multi-station test device usually includes two sets of IC test arms with the same mechanism, wherein the test arms are arranged in the center, and each set of test arms has its own independent horizontal and vertical drive system. The vertical drive system of the two sets of test arms takes the test arm as the symmetrical center, and the two sides are symmetrically distributed. The vertical drive system is installed with a...

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to provide a semiconductor electronic component detection device, which can be applied to the high-speed operation test environment, and the moving pressure rod mechanism will not be subjected to bending moment load, so as to effectively alleviate the problem of low test yield caused by uneven test pressure

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