Wafer dividing method and dividing apparatus

Abstract

The invention provides a wafer dividing method and a wafer dividing apparatus, which can confirm whether a modified layer is appropriately formed in a wafer even if the wafer is divided while being held downward. The wafer dividing method includes: a modified layer forming step of irradiating a laser beam having a wavelength permeable to the wafer while positioning a focal point of the laser beam inside a division line to form a modified layer serving as a division starting point; a frame arrangement step in which the annular frame and the wafer are bonded together by means of a dicing tape; a dividing step of dividing the wafer into individual device chips along the modified layer formed on the dividing predetermined line by expanding the dicing tape with the wafer facing downward; and a determination step in which, when the segmentation step is performed, particles scattered when the wafer is segmented are counted by a particle counter disposed on a dust collection path disposed directly below the wafer, and whether the modified layer is appropriately formed is determined on the basis of the number of particles.

Description

technical field [0001] The present invention relates to a wafer dividing method and a dividing apparatus suitable for dividing a wafer having a plurality of devices formed on the front surface divided by a plurality of intersecting planned dividing lines into individual device chips, and the dividing apparatus suitable for the dividing method . Background technique [0002] For a wafer in which a plurality of devices such as ICs, LSIs, etc. are formed on the front surface by being divided by a plurality of intersecting planned dividing lines, the condensing point of the laser beam having a wavelength that is transparent to the wafer is positioned at the dividing plan and the wafer. After irradiating the inside corresponding to the line to form a modified layer that becomes the starting point of division, the wafer is divided into individual device chips by applying an external force, and the divided device chips are used in electronic equipment such as mobile phones and pers...

AI Technical Summary

Problems solved by technology

[0006] Here, according to the technology described in the above-mentioned Patent Document 1, when an external force is applied to the wafer and divided into individual device chips, by checking the number and state of particles falling on the front surface of the wafer, it can be judged whether or not the chip is properly formed. There is a modified layer, but in the technology described in Patent Document 2, since the wafer is held downward and divided, particles do not fall and adhere to the front surface of the wafer, so the wafer cannot be confirmed after division. Whether the modified layer is properly formed on the

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