Heat conduction structure and electronic device

A heat-conducting structure and structural layer technology, applied in circuits, electrical components, semiconductor devices, etc., can solve the problems of high density, increasing the weight and thickness of heat dissipation fins or heat sinks, and poor structural strength of polymer composite materials. Improve heat conduction effect and improve heat dissipation effect

Pending Publication Date: 2022-07-29
CTRON ADVANCED MATERIAL CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, although the heat conduction effect of metal materials is very good, the density is high, which will increase the weight and thickness of the cooling fins or the overall cooling fins
However, the structural strength of polymer composite materials doped with inorganic materials is not good, and may not be suitable for some products

Method used

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  • Heat conduction structure and electronic device
  • Heat conduction structure and electronic device
  • Heat conduction structure and electronic device

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Embodiment Construction

[0027] A thermally conductive structure and an electronic device according to some embodiments of the present invention will be described below with reference to the related drawings, wherein the same components will be described with the same reference numerals. The components in the following embodiments are only used to illustrate their relative relationships, and do not represent the proportions or dimensions of real components.

[0028] When the thermally conductive structure of the present invention is applied to an electronic device, the heat dissipation efficiency of the electronic device can be improved. The heat source of the electronic device can be the battery of the electronic device, a control chip (such as a central control unit (CPU)), a driver chip, a memory (such as but not limited to an SSD solid state drive), a motherboard, a display adapter, a display panel, or a flat light source, or Other components, units, or modules that generate heat are not limited. ...

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Abstract

The invention discloses a heat conduction structure and an electronic device. The heat-conducting structure comprises a heat-conducting metal layer and a structural layer. The structural layer is arranged on the heat-conducting metal layer; wherein the structural layer is a stack structure formed by a graphene layer and a ceramic material layer; or the structural layer is a graphene mixed ceramic material layer. The heat energy generated by the heat source can be quickly conducted to the outside, and the heat dissipation efficiency of the electronic device is improved.

Description

technical field [0001] The present invention relates to a heat-conducting structure, and in particular, to a heat-conducting structure and an electronic device that can improve heat dissipation efficiency. Background technique [0002] With the development of science and technology, the design and development of electronic devices must give priority to thinning and high performance. With the requirement of high-speed computing and thinning, the electronic components of electronic devices will inevitably generate more heat than ever before. Therefore, "heat dissipation" has become an indispensable function of these components or devices. Especially for high-power components, the temperature of electronic products will rise rapidly due to the large increase in thermal energy generated during operation. drastically reduced. [0003] In the prior art, heat dissipation fins, fans, or heat dissipation elements (such as heat pipes) disposed on components or devices are mostly use...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/373
CPCH01L23/3735H01L23/373
Inventor 王鹤伟何铭祥黄军凯黄汉璋
Owner CTRON ADVANCED MATERIAL CO LTD
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