New energy automobile, circuit board and black shadow process thereof
A circuit board and black shadow technology, applied in the direction of conductive pattern formation, etc., can solve the problems of low removal rate of glue residue in drilling holes, unclean removal of glue residue, and inability to mass-produce circuit boards, etc., to achieve increased glue removal speed, Effects of improving reliability and improving glue removal quality
Pending Publication Date: 2022-07-29
湖北金禄科技有限公司
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Problems solved by technology
[0003] However, the formation of metallized holes through the black shadow process has a low removal rate of the drilled smear, resulting in the problem of unclean removal of the smear, which makes it impossible to mass-produce circuit boards through the black shadow process
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[0030] In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the related drawings. The preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that a thorough and complete understanding of the present disclosure is provided.
[0031] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for the purpose of illustration only ...
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The invention provides a new energy automobile, a circuit board and a black shadow process of the circuit board. The black shadow process of the circuit board comprises part of or all of the following steps that a board is soaked in a bulking solution at a first preset temperature so as to perform bulking operation on residual glue on hole walls of the board, the bulking concentration of the bulking solution is 40%-50%, and the first preset temperature is larger than or equal to 75 DEG C; the bulked plate is soaked in a degumming solution so as to carry out degumming operation; placing the degummed plate in an acid solution for neutralization operation; and placing the neutralized plate in the black shadow glue solution so as to form a conductive layer on the hole wall of the plate. According to the black shadow technology of the circuit board, the glue removing speed after the residual glue on the hole wall of the board is subjected to the bulking operation is well improved, the glue removing quality of the hole wall of the board is improved, glue residues of drilled holes can be effectively removed, and the reliability of hole metallization of the board is improved.
Description
technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a new energy vehicle, a circuit board and a shading process thereof. Background technique [0002] In the production of circuit boards for new energy vehicles, after drilling, the hole walls of the through holes of the circuit board have no conductive layer. Traditional circuit boards are metallized by copper sinking before electroplating, so as to provide electroplating A conductive layer is provided. The copper sinking process mainly uses the working principles of hole wall charge adjustment, activated palladium adsorption and formaldehyde reduction, so that a large amount of chemicals need to be used in the hole metallization of the circuit board, and the chemical instability factors, and then make the hole metallization. The reliability is poor; the shadow process uses graphene adsorption and forms metallized holes through the working principle of drying and...
Claims
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IPC IPC(8): H05K3/10
CPCH05K3/10H05K3/107
Inventor 王性鹏严杰周爱民时越聂荣贤
Owner 湖北金禄科技有限公司