Cold electron erase in thin film memory transistors

A storage transistor, electronic technology, applied in information storage, static memory, read-only memory, etc., can solve the problem of harmful persistence of storage transistors

Pending Publication Date: 2022-08-02
SUNRISE MEMORY CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

These interface traps are detrimental to the persistence of memory transistors and may in fact be the main cause of closing the write window

Method used

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  • Cold electron erase in thin film memory transistors
  • Cold electron erase in thin film memory transistors
  • Cold electron erase in thin film memory transistors

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Embodiment Construction

[0029] The present invention utilizes a device structure in a desired low energy range (referred to as "cold electrons") to ensure that electrons tunnel out of a charge trapping layer into the channel region of a memory transistor (eg, during an erase operation) so that the final The hole generation is also low energy, so there is less damage to the write window, improving the endurance of the memory transistor to more than 10 11 write-erase cycles. The device structure provides a substantial direct tunneling write current density in excess of 1.0 amps / cm 2 (eg 5.0amps / cm 2 ). The present invention is particularly advantageous for use with memory layers that form thin film memory transistors in three-dimensional memory structures, such as the quasi-volatile memory transistors previously described by Harari in three-dimensional arrays of inverse-OR gate memory strings.

[0030] An embodiment of the present invention consists of Figure 5 , which shows conduction band bounda...

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Abstract

A memory transistor has a tunneling dielectric layer and a charge trapping layer between a channel region and a gate electrode, where the charge trapping layer has a conduction band step lower than a low point of a tunneling barrier in the tunneling dielectric layer when a write voltage is applied such that electrons directly tunnel into the charge trapping layer. The conduction band step of the charge trapping layer is located between-1.0 electron volt and 2.3 electron volt. The memory transistor may include a barrier layer between the tunneling dielectric layer and the charge trapping layer, the barrier layer having a conduction band step smaller than a conduction band step of the charge trapping layer.

Description

technical field [0001] The present invention relates to a writing and erasing system in thin film memory transistors. In particular, the present invention utilizes cold electron erasing in a thin film transistor for fast writing and erasing operations, which also provides the additional advantage of achieving high durability. Background technique [0002] U.S. Published Patent No. 2019 / 0006015 ("Harari"), entitled "Capacitively Coupled Nonvolatile Thin-Film Transistor Strings in Three-Dimensional Arrays," published Jan. 3, 2019, discloses thin-film The memory transistors form an Inverted Or Gate (NOR) memory string. Harari's thin-film transistors can be written and erased in 100 nanoseconds (ns) or less, making them suitable for many applications in typical volatile memory devices, such as dynamic random access memory (DRAM) devices. Harari's thin-film memory transistors also have the advantage of a retention time of several minutes, compared to just a few milliseconds in ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G11C16/10G11C16/14H01L21/28H01L29/792
CPCH01L29/40117H01L29/40114H01L29/792H01L29/7883G11C16/10G11C16/14H01L29/517H01L29/513H01L29/4234H10B43/30
Inventor 赛義夫·萨拉胡丁乔治·莎玛奇沙武儀·亨利·简叶利·哈拉里
Owner SUNRISE MEMORY CORP
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