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General carrier boat for ceramic packaging of semiconductor chip

A ceramic packaging and semiconductor technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of difficulty in batch production, increase the cost of tooling and fixture processing and maintenance, and unfavorable batch production, so as to reduce load It has the effect of designing and manufacturing, shortening the cycle of product introduction and production debugging, and reducing the cost of mass production

Pending Publication Date: 2022-08-05
南京睿芯峰电子科技有限公司
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AI Technical Summary

Problems solved by technology

[0003] Different from the whole substrate or frame package of plastic package, the ceramic package starts with a single ceramic shell, and the ceramic size and number of pins of the shell of different package forms and models are quite different. This feature brings greater difficulty to the mass production of packaging. Different packaging products need to make corresponding tooling and loading. It takes a lot of time to debug the loading and unloading before mass production. At the same time, packaging tooling and fixtures are added Processing and maintenance costs, not conducive to mass production

Method used

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  • General carrier boat for ceramic packaging of semiconductor chip
  • General carrier boat for ceramic packaging of semiconductor chip
  • General carrier boat for ceramic packaging of semiconductor chip

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Embodiment Construction

[0023] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

[0024] refer to Figure 1-3 As shown, a general carrier boat for ceramic packaging of semiconductor chips includes a base 1, and a loading station is evenly arranged on the base 1, and a plurality of storage slots 11 for placing products are arranged on the loading station. Both sides of the loading station are provided with support plates 3, and the support plates 3 are connected with the base 1 through connectors, and the side walls of the storage slot 11 are provided with steps 12 for supporting products;

[0025] It also includes an adjustment assembly, the adjustment assembly includes an adjustment plate 2, the adjustment plate 2 is slidably arranged in the middle of the base 1, a...

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Abstract

The invention relates to the technical field of semiconductor packaging, in particular to a universal carrier boat for ceramic packaging of semiconductor chips. All the containing grooves are synchronously adjusted by adjusting the supporting plates and the adjusting blocks so that products can be loaded conveniently, the device can meet the batch production requirement of tube shell ceramic packaging of different sizes and models, the requirement of a multi-variety and small-batch discrete type production mode is met, the product introduction and production debugging period is shortened, and the production efficiency is improved. And the design and manufacturing of multiple types of carriers are reduced, the workload of carrier maintenance and repair is reduced, and the mass production cost is greatly reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, and relates to a general carrier boat for ceramic packaging of semiconductor chips. Background technique [0002] With the rapid development of integrated circuits, the demand for high-reliability and high-end components is also increasing. Ceramic package components have been widely used in some special equipment and equipment due to their high reliability and strong stability. In recent years, as the pace of localization has gradually accelerated, the demand for the development of domestic ceramic packaging has become increasingly urgent. [0003] Different from the plastic package of the whole substrate or the frame package, the ceramic package starts with a single ceramic tube shell, and the shell ceramic size and number of pins of different package forms and models are quite different. It is precisely because of the ceramic package. This feature brings great difficulty to t...

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Application Information

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IPC IPC(8): H01L21/673
CPCH01L21/6732
Inventor 李良海李宗亚高辉
Owner 南京睿芯峰电子科技有限公司
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