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A technology of sub-modules and components, applied in the direction of coating non-metallic protective layer, magnetic field/electric field shielding, circuit, etc., can solve the problems of decreased degree of freedom and decreased degree of freedom of substrate design

Pending Publication Date: 2022-08-05
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thus, the degree of freedom in the layout of other wiring or components on the surface of the substrate is reduced.
Furthermore, in the case of grounding the shield wall through the surface electrode, it is necessary to prepare wiring for ground connection on the surface or inside of the substrate, and the degree of freedom in the design of the substrate is reduced.

Method used

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Examples

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Effect test

Embodiment approach 1

[0046] refer to Figure 1 to Figure 4 , the modules in Embodiment 1 based on the present invention will be described.

[0047] figure 1 The appearance of the module 101 in this embodiment is shown. The upper surface and side surfaces of the module 101 are covered with the external shielding film 8 . figure 2 shows from figure 1 The situation of the module 101 is observed obliquely below in the . image 3 A bottom view of the module 101 is shown. The lower surface of the module 101 is not covered by the external shielding film 8 . One or more external terminals 17 are provided on the lower surface of the module 101 . In the example shown here, the plurality of external terminals 17 are arranged annularly along the outer periphery of the lower surface of the module 101 . figure 2 and image 3 The number, size, and arrangement of the external terminals 17 shown are just an example. Figure 4 show along image 3 A cross-sectional view of the line IV-IV in . exist im...

Embodiment approach 2

[0066] refer to Figure 16 to Figure 17 , the modules in Embodiment 2 based on the present invention will be described. Figure 16 A bottom view of the module 102 in this embodiment is shown. Figure 17 show along Figure 16 A cross-sectional view taken along line XVII-XVII in . exist Figure 16 In the figure, components built into the module 102 in a state of being sealed with resin are shown by broken lines.

[0067] The module 102 includes a main substrate 1 , a submodule 81 i , a first member 31 , and a first sealing resin 6 a , wherein the main substrate 1 has a first surface 1 a and a second surface 1 b that is the opposite of the first surface 1 a On the side surface, the sub-module 81i is formed to have a smaller area than the main board 1 and is attached to the first surface 1a, the first member 31 and the sub-module 81i are separately attached to the first surface 1a, and the first sealing resin 6a is formed to cover the first surface 1a and the first part 31 . ...

Embodiment approach 3

[0077] refer to Figure 22 to Figure 23 , the module in Embodiment 3 based on the present invention will be described. Figure 22 A bottom view of the module 103 in this embodiment is shown. Figure 23 show along Figure 22 A cross-sectional view of the XXIII-XXIII line in . exist Figure 22 In the figure, components built into the module 103 in a state of being sealed with resin are shown by broken lines.

[0078] The module 103 includes the main substrate 1, the sub-module 81j, the first member 31, and the first sealing resin 6a, wherein the main substrate 1 has a first surface 1a and a second surface 1b that is the opposite of the first surface 1a On the side surface, the sub-module 81j is formed to be smaller in area than the main board 1 and is attached to the first surface 1a, the first member 31 and the sub-module 81j are separately attached to the first surface 1a, and the first sealing resin 6a is formed to cover the first surface 1a and the first part 31 .

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Abstract

A module (101) is provided with a main substrate (1), a sub-module (81) mounted on a first surface (1a) of the main substrate (1), a first member (31) mounted on the first surface (1a) separately from the sub-module, and a first sealing resin (6a) formed so as to cover the first surface (1a) and the first member (31). The sub-module (81) is provided with a second member (32), a second sealing resin (6c) disposed so as to cover the second member, and an inner shield film (9) formed so as to cover at least a portion of a side surface of the second sealing resin (6c) and not electrically connected to the main substrate (1). The ground connection conductor (45) is disposed so as to be electrically connected to the inner shield film (9), and the ground connection conductor (45) is exposed to the outside.

Description

technical field [0001] The present invention relates to a module. Background technique [0002] In International Publication WO2018 / 101384 (Patent Document 1), a device called a "high-frequency module" is described. In Patent Document 1, a sealing resin layer is arranged on the surface of a wiring board, and a shield wall is formed so as to penetrate the sealing resin layer. The shield wall is connected to the surface layer electrode arranged on the surface of the wiring board. In the invention described in Patent Document 1, in order to form the shield wall, a method of forming a groove in the sealing resin layer by laser processing and filling the groove with a conductive paste or the like is employed. [0003] Patent Document 1: International Publication No. WO2018 / 101384 [0004] In the case of a module having a cell shield structure, it is a problem how to ground the shield member arranged inside the sealing resin. The shield wall described in Patent Document 1 is a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/04H01L23/00H01L23/28H01L25/18H01L25/10H05K9/00H05K3/28
CPCH05K3/28H01L2924/181H01L2224/16225H01L23/5383H01L21/568H01L21/561H01L23/3121H01L21/56H01L23/552H01L25/165H01L2924/00012H01L21/4853H01L21/4857H01L21/565H01L23/49822H01L23/49838
Inventor 大坪喜人楠山贵文
Owner MURATA MFG CO LTD