Electronic equipment chip pin defect detection method and system

Abstract

The invention discloses an electronic equipment chip pin defect detection method and system, and relates to the field of artificial intelligence. The method mainly comprises the following steps: acquiring surface images of a to-be-detected chip at different light source angles, and obtaining reflectivity graphs corresponding to the surface images by using a photometric stereo method; detecting a chip polarity mark in the surface image by utilizing Hough transform; performing global threshold processing on the reflectivity image to obtain a binary image, and obtaining each pin connected domain in the binary image; respectively obtaining the center of each pin connected domain, and obtaining the centroid of a polygonal region formed by the centers of the pin connected domains; constructing feature description vectors corresponding to the connected domains, matching the pin connected domains of the to-be-detected chip and the standard chip by using the feature description vectors, and taking the pin connected domains which are not matched as defect areas in the to-be-detected chip. According to the embodiment of the invention, the pin defect in the chip in the production process can be detected, and meanwhile, a large number of chip samples with defects do not need to be collected.

Description

technical field [0001] The present application relates to the field of artificial intelligence, and in particular to a method and system for detecting pin defects of electronic equipment chips. Background technique [0002] With the rapid development of various high-precision fields such as military industry and aerospace, the requirements for the quality and reliability of chips are also getting higher and higher. Therefore, the defect detection of chips in the production process is particularly important. Although the test of chip electrical performance in defect detection is a necessary prerequisite for chip quality assurance, the reliability detection of chip appearance surface defects such as chip surface integrity, chip pins, etc. also plays an important role in chip screening. At present, the traditional manual visual inspection method is still used in the field of chip appearance defect detection, but this method requires a lot of manpower and material resources, wh...

AI Technical Summary

Problems solved by technology

[0005] In view of the above technical problems, the present invention provides a method and system for detecting defects in chip pins of electronic equipment, which can detect defects existing in chip pins in the production process without collecting a large number of defective chip samples, and at the same time through machine The visual method avoids the subjectivity brought by artificial naked eyes, thus improving the defect detection efficiency of chip pins

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