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Methods of making conductive traces and resulting structures

A conductive trace, electrochemical technology, used in circuits, electrical components, semiconductor devices, etc., can solve the problems of signal loss, damage to high-frequency signal transmission, etc.

Pending Publication Date: 2022-08-09
MICRON TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, high frequency signal transmission suffers due to skin effect, resulting in signal loss and requiring additional power to maintain signal speed

Method used

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  • Methods of making conductive traces and resulting structures
  • Methods of making conductive traces and resulting structures
  • Methods of making conductive traces and resulting structures

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] Embodiments of the present invention include methods of forming conductive traces that exhibit smooth surface finishes. When transmitting high frequency signals, the conductive traces so formed substantially eliminate the skin effect and exhibit reduced impedance, thereby enhancing signal transmission speed without increasing power requirements.

[0021] The following description provides specific details (eg, size, shape, material composition, and orientation) in order to provide a thorough description of embodiments of the invention. However, it will be understood by those skilled in the art that embodiments of the present invention may be practiced without employing these specific details. Embodiments of the present invention may be practiced with conventional fabrication techniques employed in the industry. Additionally, the descriptions provided below do not form a complete process flow for fabricating RDLs or other electronic structures that include conductive tr...

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Abstract

The invention relates to a method of making a conductive trace and the resulting structure. One embodiment is a method of forming a conductive trace, comprising: forming a seed material over a surface of a substrate; forming a patterned mask material over the seed material to define a trench such that a portion of the seed material within the trench is exposed; and depositing a conductive material over the exposed seed material in the trench to form a conductive trace. At least a portion of the patterned mask material is removed, a barrier layer is formed over side and upper surfaces of the conductive trace, and an exposed portion of the seed material is removed. Conductive traces and structures incorporating conductive traces are also disclosed.

Description

[0001] Divisional Application Information [0002] The present invention is a divisional application of an invention patent application with an application date of December 12, 2018, an application number of 201811520796.8, and an invention title of "method for making conductive traces and resulting structure". [0003] priority claim [0004] This application claims the benefit of the filing date of US Patent Application Serial No. 15 / 841,660, "METHODS OF FABRICATING CONDUCTIVE TRACES ANDRESULTING STRUCTURES," filed on December 14, 2017. technical field [0005] Embodiments disclosed herein relate to methods for making conductive traces and conductive traces so formed. More specifically, embodiments disclosed herein relate to methods and resulting structures for fabricating conductive traces for high frequency signal transmission, including, without limitation, redistributions incorporating such conductive traces Layers (RDLs) and assemblies that contain such RDLs. Bac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H01L23/498
CPCH01L23/49838H01L23/49811H01L21/4846H01L2224/17106H01L24/13H01L24/16H01L24/81H01L25/0655H01L2224/131H01L2224/16227H01L2224/81192H01L2924/15311H01L2924/3011H01L24/17H01L21/76852H01L21/76885H01L2924/013H01L2924/00014H01L21/76865H01L21/76873H01L23/53238H01L2224/0231H01L2224/0239
Inventor 克里斯托弗·J·甘比
Owner MICRON TECH INC