Manufacturing method of electrooptical device and dectrooptical device
An electro-optic device and manufacturing method technology, which is applied in the fields of printed circuit manufacturing, electrical component assembly of printed circuits, identification devices, etc., and can solve the problems of terminal reliability degradation and different positions
Inactive Publication Date: 2004-10-20
SEIKO EPSON CORP
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Problems solved by technology
[0005] However, since the flexible substrate thermally expands during the thermocompression bonding, there is a problem that the positions of the terminals formed on the flexible substrate are different from those before thermocompression bonding.
Moreover, if such a positional displacement of the terminal occurs, the terminal is not connected to a terminal on the panel substrate to be connected originally, but is connected to an adjacent terminal, or is connected across a plurality of terminals on the panel substrate, In such a case, there is a problem that the reliability of the connection between the terminals decreases
Such a problem becomes particularly serious when the pitch of the terminals formed on the substrate of the electro-optical panel is narrow.
Method used
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Embodiment 2
[0066] In this embodiment, UPILEX (trade name; manufactured by Ube Industries, Ltd.) was used as the base material 11a of the output terminal 11c. At this time, the coefficient of linear expansion of the base material 11a when the measurement conditions are set at 20°C to 100°C is 0.8×10 -5 / K to 1.0×10 -5 / K, the thickness is 5μm to 75μm. When the wiring substrate 11 using such a base material 11a was crimped to the substrate 6a under the conditions of a crimping temperature of 170° C., a crimping pressure of 3 MPa, and a crimping time of 20 seconds, the wiring substrate 11 was obtained. The result of stretching at a rate of 0.2% in the direction in which the output terminals 11c are arranged. Based on this result, the pitch of the output terminals 11c before thermocompression bonding was set to 0.998 of the pitch of the terminals 9 so that the elongation of the wiring board 11 described above could be compensated. . In addition, the interval of the alignment mark 15 is m...
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Abstract
The aim of the invention is to provide a method of connecting terminals in high accuracy between a terminal on a substrate and a terminal of a packaging base material. The substrate 6a in which the terminal 9 is formed and a wiring substrate 11 equipped with a terminal 11c for output are joined to each other via an anisotropic conductive film (ACF) 20. The pitch P2 of the terminal 11c for output is made to be different from the pitch P1 of the terminal 9 by taking the deformation of the substrate 6a or the wiring substrate 11 in joining of them into consideration. Both terminals are connected while the pitch P1' of the terminal 9 and the pitch P2' of the terminal 11c for output are about the same in keeping with the deformation of the substrate 6a or the wiring substrate 11 which occurs at the time of joining.
Description
technical field [0001] The present invention relates to a method for manufacturing an electro-optical device, a method for connecting terminals, an electro-optical device, and an electronic device, and particularly relates to a technique for connecting terminal groups formed in each of a plurality of base members. Background technique [0002] In recent years, electro-optic devices typified by liquid crystal devices and electroluminescent (EL) devices have been widely used as display devices for various electronic devices such as mobile phones and portable information terminals. This electro-optical device is often used to display information such as characters, numbers, figures, and the like. [0003] Such an electro-optical device generally includes: a substrate for holding an electro-optic substance such as liquid crystal or EL; and electrodes formed on the substrate to apply a voltage to the electro-optic substance. For example, in a liquid crystal device using liquid c...
Claims
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IPC IPC(8): G02F1/1345G02F1/13G09F9/00H01L21/60H05K1/02H05K3/32H05K3/36
CPCH05K3/361H05K1/0269H05K2201/068H05K2201/09918G02F1/13452H05K2203/166H05K2201/09781H05K2201/09427H05K3/323H01L2224/16225H01L2224/32225H01L2224/73204H01L2924/00014H01L2924/00H01L2224/0401G02F1/1345
Inventor 内山宪治
Owner SEIKO EPSON CORP