Unlock instant, AI-driven research and patent intelligence for your innovation.

Printed circuit board with built-in resistor and its making method

A technology for printed circuit boards and resistors, which is applied in printed circuit manufacturing, printed circuit, resistor manufacturing, etc., and can solve problems such as resistance deviation from the target value

Inactive Publication Date: 2005-03-02
SAMSUNG ELECTRO MECHANICS CO LTD
View PDF4 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, the final resistance will deviate greatly from the target value

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Printed circuit board with built-in resistor and its making method
  • Printed circuit board with built-in resistor and its making method
  • Printed circuit board with built-in resistor and its making method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0048] The application of the preferred embodiment of the present invention will be better understood below with reference to the drawings, in which like reference numerals are used for like and corresponding parts, respectively.

[0049] Figures 2a to 2g The fabrication of a PCB with embedded resistors according to the invention is illustrated step by step.

[0050] refer to Figure 2a , forming a pattern of a conductive metal layer such as a bare copper layer on the substrate 1 . Have electrical insulation, be used in the substrate 1 of the present invention and can be made of coated epoxy resin glass, polyimide, cyanate ester, bismaleimide triazine (BT), polytetrafluoroethylene and the like become. However, it must be noted that the above-mentioned materials do not limit the scope of the present invention, but are illustrative, and any PCB substrate used in the art may be used without specific limitation. The patterned metal layer can be formed by common methods known ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

Disclosed are a PCB with buried or embedded resistors and a method for manufacturing the same. The PCB comprises: a resinous, electrically insulating substrate; a circuit pattern formed on the substrate; at least a pair of spaced resistor terminations, formed in a certain pattern on the substrate, each comprising a metal pad covered with a conductive protective layer; a thin-film resistor formed between the resistor terminations with electrical connection thereto; and an over-coating layer formed of one-part ink, covering the resistor and the resistor terminations. To be provided with a desired resistance, optionally, the resistor may be grooved by laser trimming. The PCB can have a desired resistor resistance which is uniform without being affected by environmental factors.

Description

technical field [0001] The present invention relates to a printed circuit board (PCB) with buried or embedded resistors and a method of manufacturing the same. More particularly, the present invention relates to a PCB in which a resistor is embedded, the resistance of which is uniform and not affected by external environments, and a method of manufacturing the same. Background technique [0002] The PCB is provided for mounting circuit components thereon, and has wiring formed by a printing method. These components are arranged and connected to each other according to a certain circuit design. Most of the components that make up the circuit are chip-type, and in order to realize signal connections between components (such as signal transmission in ICs, external signal input / output, etc.), discrete chip resistors are directly mounted on the surface of the PCB. However, the use of discrete chip resistors does not satisfy the demand for high-density integration accompanying h...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22H01B1/24H01C17/065H05K1/09H05K1/16H05K3/24H05K3/28
CPCH05K1/167H01B1/24H05K3/243H05K2203/1453Y10T29/49101H05K3/28H05K2203/107Y10T29/49126H01C17/0652Y10T29/4913H05K2203/171H01B1/22H05K1/095H05K1/16
Inventor 朴建阳康丈珪李硕揆
Owner SAMSUNG ELECTRO MECHANICS CO LTD