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Apparatus and method for inspection

A detection device and signal detection technology, which is applied to measurement devices, error detection/correction, and electrical measurement, can solve problems such as inability to judge the shape of circuit wiring

Inactive Publication Date: 2005-08-24
OHT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the above-mentioned existing non-contact detection technology can only judge whether there is a loop wiring at a specific position on the circuit board, and cannot allow the operator to intuitively judge the shape of the loop wiring

Method used

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  • Apparatus and method for inspection

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Experimental program
Comparison scheme
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no. 1 approach

[0045] The detection system 20 using a metal-oxide semiconductor field effect transistor (MOSFET) as a sensing element as a first embodiment of the present invention will be described below.

[0046]

[0047] FIG. 2 is a schematic diagram showing an inspection system 20 for inspecting the circuit wiring 101 on the circuit board 100 .

[0048] The detection system 20 has a sensor chip 1 on which a plurality of sensor elements are arranged, an electronic computer 21, an electrode contact 22 for supplying a detection signal to the loop wiring 101, and a selection member for switching the detection signal supplied to the electrode contact 22. twenty three. The selection section 23 may be constituted by, for example, a multi-channel modulator, a deflector (deplexa), or the like.

[0049] The electronic computer 21 can supply a control signal for selecting the electrode contact 22 with respect to the selection part 23, and a detection signal applied to the loop wiring 101, and ca...

no. 2 approach

[0154] Next, a detection system as a second embodiment of the present invention will be described with reference to FIG. 16 .

[0155] The inspection system of this embodiment is different from the above-mentioned first embodiment in that not only gold samples but also design image data (for example, CAD data, etc.) are compared with circuit wirings to be inspected. Except for this point, they are similar to the first embodiment, so their detailed descriptions are omitted here, and the same constituent elements have been denoted by the same reference numerals in the drawings.

[0156] FIG. 16 is a flowchart showing a process of performing preliminary detection and measuring the positional deviation of the circuit board before starting the detection.

[0157] In step S181, in one screen, two to three loop wirings on the circuit substrate to be inspected are detected as preprocessing loop wirings (markers). That is, image data representing the shapes of two to three marks space...

no. 3 approach

[0165] Next, a detection system as a third embodiment of the present invention will be described with reference to FIGS. 17 to 19 .

[0166] The detection system of this embodiment is different from the above-mentioned first embodiment in that it simultaneously detects two adjacent columns of loop wiring in one screen. Except for this point, they are similar to the first embodiment, so their detailed descriptions are omitted here, and the same constituent elements have been denoted by the same reference numerals in the drawings.

[0167] FIG. 17 is an explanatory diagram for explaining the order of voltage application to the circuit wirings when there are a plurality of loop wirings on one circuit board. In FIG. 17 , similarly to FIG. 1 , for simplicity of description, the loop wirings to be detected are shown as ◯, and the shape of the loop wirings is modeled as a rectangular shape with m rows and n columns.

[0168] In this embodiment, as shown in the figure, in the first p...

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Abstract

Circuit wiring is inspected visually. An inspection system (20) comprises a sensor chip (1) equipped with a plurality of sensor elements, a computer (21), probes (22) for supplying a test signal to circuit wiring (101), and a selector (23) for changing the paths of the test signal to the probes (22). The computer (21) receives the signal detected by the sensor chip (1) and generates image data, and a display (21a) displays the image of the circuit wiring of interest. This allows the shape of a particular circuit wiring to be found. Any defect of the circuit wiring (101), such as a discontinuity and a short circuit, can also be detected using the obtained image data and the image data indicative of the designed circuit wiring.

Description

technical field [0001] The invention relates to a detection device and a detection method of a circuit board. Background technique [0002] In the manufacturing process of the circuit substrate, after the circuit wiring is arranged on the substrate, it is necessary to detect whether the circuit wiring has any faults such as disconnection and short circuit. [0003] In recent years, with the high density of circuit wiring, it has been difficult to obtain enough space for each lead pin to be set at the same time and contact the circuit wiring at each circuit wiring, so some people have proposed different methods. Furthermore, the lead pins are provided, so that the non-contact detection technology of electrical signal reception can be implemented without being in contact with the circuit wiring (Japanese Patent Laid-Open No. 9-264919). [0004] This non-contact detection technology is shown in Figure 22. One end of the loop wiring as the detected object is in contact with the...

Claims

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Application Information

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IPC IPC(8): G01R31/02G01R31/302G01R31/304G01R31/312H05K3/00
CPCG01R31/312G01R31/302G01R31/304G01R15/165G01R31/31725G01R31/3183G06F11/321
Inventor 藤井达久石冈圣悟山冈秀嗣
Owner OHT