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Grinding mat capable of showing abradability automatically and its manufacturing method

A technology for automatic display and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., and can solve problems such as unclean surface of the polishing pad and damage to the polishing pad.

Inactive Publication Date: 2006-06-21
NAN YA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in the known measurement method, the polishing pad will be damaged or the surface of the polishing pad will be unclean

Method used

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  • Grinding mat capable of showing abradability automatically and its manufacturing method
  • Grinding mat capable of showing abradability automatically and its manufacturing method
  • Grinding mat capable of showing abradability automatically and its manufacturing method

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0013] Such as Figure 1a-Figure 1b Shown in is a schematic flow chart of the manufacturing method of the polishing pad that can automatically display the degree of wear of the present invention.

[0014] First, if Figure 1a As shown in , a grinding substrate 100 is provided, which has a grinding surface SF1 and a back surface SF2.

[0015] Generally speaking, the polishing substrate is usually made of polyurethane (polyurethane) material, which is firstly formed into a cylinder, and then cut into a plurality of pieces with a predetermined thickness Ts. The substrate is ground, wherein the predetermined thickness Ts of the ground substrate is approximately several millimeters.

[0016] Next, using laser light or mechanical means to drill holes in the back surface SF2 of the grinding substrate 100, respectively forming at least one first mark hole V1 with a first predetermined depth d1 and at least one second mark with a second predetermined depth d2 hole V2, and at least on...

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PUM

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Abstract

A polishing pad for automatically displaying the degree of wear, comprising a polishing substrate, having a polishing surface, a reference surface, at least one first marking hole, arranged at a first predetermined distance below the polishing surface, and at least one second marking hole , arranged at a second predetermined distance below the grinding surface, and at least one third marking hole, arranged at a third predetermined distance below the grinding surface, wherein the first, second and third marking holes are formed by the The reference plane extends toward the grinding surface, and the third predetermined distance is greater than the second predetermined distance, and the second predetermined distance is greater than the first predetermined distance.

Description

technical field [0001] The present invention relates to a polishing pad and its manufacturing method, in particular to a polishing pad which can automatically display the degree of wear and its manufacturing method. Background technique [0002] In recent years, with the increase in the integration and density of semiconductor devices, more and more devices have thin-film structures, so that a technology that can accurately planarize the thin-film surface on the surface of the thin-film structure is required. [0003] One of the wafer planarization techniques is chemical mechanical polish. In this technique, a wafer held by a carrier is pressed against a polishing pad attached to a rotating platform, and the polishing pad is used to polish the surface of the wafer while being supplied with a chemical polishing solvent. [0004] Because the degree of wear of the polishing pad has a very large impact on the grinding efficiency of the entire chemical mechanical polishing proce...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/304B24B1/04
Inventor 陈志焜龚耀雄
Owner NAN YA TECH