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Semiconductor memory

A memory and semiconductor technology, applied in static memory, read-only memory, digital memory information, etc., can solve the problem of increasing off-state leakage current of transistors, and achieve the effect of realizing storage capacity and realizing large-scale

Inactive Publication Date: 2006-08-09
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, the off-leakage current of transistors increases rapidly due to miniaturization, and the above-mentioned problem has become a major problem in the realization of semiconductor memories.

Method used

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  • Semiconductor memory
  • Semiconductor memory
  • Semiconductor memory

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0091] figure 1 It is a circuit diagram of the structure of the semiconductor memory device of the first embodiment of the present invention.

[0092] exist figure 1 Among them, the semiconductor memory is composed of memory cell arrays 1, 2, column decoders 3, 4, precharge transistors 5, 6, readout circuits 7, 8, output selection circuit 9, and source potential control circuit 10. The memory cell arrays 1 and 2, the column decoders 3 and 4, the precharge transistors 5 and 6, the readout circuits 7 and 8, and the output selection circuit 9 are the same as those of the conventional example, so the same reference numerals are assigned to the same members and omitted. illustrate.

[0093] The source potential control circuit 10 is composed of an NOT gate INVSi (i=1 to m). The input ends of the "not" gate INVSi (i=1~m) are respectively connected to the word line terminals WLi (i=1~m), and the output ends are respectively connected to the source lines GL1i (i=1~m) and On the ...

no. 2 Embodiment

[0101] image 3 It is a circuit diagram of the structure of the semiconductor memory device of the second embodiment of the present invention.

[0102] exist image 3 Among them, the semiconductor memory is composed of memory cell arrays 1, 2, column decoders 3, 4, precharge transistors 5, 6, readout circuits 7, 8, output selection circuit 9, and source potential control circuit 11. The memory cell arrays 1 and 2, the column decoders 3 and 4, the precharge transistors 5 and 6, the readout circuits 7 and 8, and the output selection circuit 9 are the same as those of the conventional example, so the same reference numerals are assigned to the same members and omitted. illustrate.

[0103] The source potential control circuit 11 is composed of N-type MOS transistors QWi (i=1 to m). The gates of N-type MOS transistors QWi (i=1~m) are respectively connected to word line terminals WLi (i=1~m), and the drains are respectively connected to source lines GL1i (i=1~m) and On the sour...

no. 3 Embodiment

[0112] Figure 5 It is a circuit diagram of the structure of the semiconductor memory device of the third embodiment of the present invention.

[0113] exist Figure 5 Among them, the semiconductor memory is composed of memory cell arrays 1, 2, column decoders 3, 4, precharge transistors 5, 6, readout circuits 7, 8, output selection circuit 9, and source potential control circuit 12. The memory cell arrays 1 and 2, the column decoders 3 and 4, the precharge transistors 5 and 6, the readout circuits 7 and 8, and the output selection circuit 9 are the same as those of the conventional example, so the same reference numerals are assigned to the same members and omitted. illustrate.

[0114] The source potential control circuit 12 is composed of an NOT gate INVGi (i=1-m), an N-type MOS transistor QWVi (i=1-m), and an N-type MOS transistor QWGi (i=1-m). The input ends of the "invert" gate INVGi (i=1~m) are respectively connected to the word line terminals WLi (i=1~m), and the ou...

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PUM

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Abstract

By eliminating a current of bit lines which is generated regularly by an off-leak current in memory cells, the number of memory cells per bit line is made to increase, large storage capacity of the memory cell array is achieved, and a semiconductor memory device capable of reducing a chip area is provided. In order to achieve it, provided is a source line potential control circuit for setting a source potential of transistors included in the memory cells being selected by row selection signals at a ground potential, and for setting a source potential of the transistors included in the memory cells being set as a non-selection state by the row selection signals at a power potential. A potential difference between sources and drains of the transistors included in the memory cells of the non-selection state is thereby reduced, and the leakage current is eliminated.

Description

technical field [0001] The present invention relates to semiconductor memory, and in particular to circuit technology for realizing large-scale memory cell array. Background technique [0002] Figure 17 It is a circuit diagram showing an example of the structure of a contact-type mask ROM as a conventional semiconductor memory. The so-called contact mask ROM is to make whether the drain of the memory cell transistor is connected to the bit line respectively corresponds to "0" and "1" of the stored data. [0003] exist Figure 17 Among them, the conventional semiconductor memory is composed of memory cell arrays 1, 2, column decoders 3, 4, precharge transistors 5, 6, readout circuits 7, 8, and output selection circuit 9. [0004] The memory cell array 1 is configured by arranging memory cells M1(i, j) (i=1-m, j=1-n) composed of N-type MOS transistors in a matrix, that is, in rows and columns. [0005] For every n memory cells M1(i,j) that have the same value i and are arra...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G11C17/18G11C11/413G11C7/22G11C8/08G11C17/12
CPCG11C7/22G11C8/08G11C17/12G11C2207/2281
Inventor 林光昭仲矢修治小岛诚
Owner PANASONIC CORP
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