Nano thin film probe card and manufacturing method thereof

Abstract

The production method of high conductive nano film probe card includes the following steps: firstly, vertically arranging several nano tubes or nano wires on one face of a base plate; filling high-molecular resin material with predefined viscosity between nano tubes or nano wires and solidifying to form a high conductive nano film, said film has first end connected on said base plate and second end positioned on the position of opposite end of the first end; removing partial high-molecular material from second end place of said film; removing said base plate, at the same time preparing a ceramic base plate, one face of said base plate has several conductive connecting points, its another face has several metal projections; assembling said film on said ceramic base plate, making the preset nano tubes or nano wires of said first end be contacted on the conductive connecting points of said ceramic base plate; using etching process to respectively form recessed holes on position of second end said film, said recessed holes are correspondent to said metal projections, and respectively filling a metal projection on every recessed hole.

Description

technical field [0001] The present invention is related to the manufacturing method of the probe card used for pin testing electronic components, in particular to a nano film type probe card and its manufacturing method. Background technique [0002] Press, the probing technology of electronic components in the future will face technical challenges such as ultra fine pitch, area array testing, high frequency and low cost. [0003] At present, the needle testing technology that has been commercialized is mainly divided into two categories in high-frequency testing, one is coaxial probe card and ceramic blade probe card, and the other is Membrane probe card, as disclosed in US Pat. No. 5,090,118. Wherein, since the first type of probe card is manually assembled and fixed on a printed circuit board (PCB) with coaxial probes or ceramic blade probes one by one, It is bound to be unable to meet the requirements of ultrafine pitch (ultrafine pitch) in the future, and its test fre...

AI Technical Summary

Problems solved by technology

[0004] 1. This type of probe card still cannot meet the technical requirements of the test frequency of 40GHz in the future RF device (RF device) test

[0005] 2. Due to the elastic limitation of the polymer film, it is difficult for this type of probe card to compensate the error of the common plane of the object under test, which will make it difficult for this type of probe card to be used in multi-DUT testing (multi-DUTDie Under Test testing)

[0006] 3. The cost of this type of probe card is too high, and its price is about 2 to 3 times that of the current traditional probe card

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