Method for producing high conducting electric nano-thin film type probe card
A technology of nano-film and manufacturing method, which is applied in the manufacturing field of high-conductivity nano-film probe card, can solve the problem that the probe card is difficult to be applied in multi-DUT testing, the cost of the probe card is high, and the probe card is difficult to compensate for errors. And other issues
Inactive Publication Date: 2004-11-24
IND TECH RES INST
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Problems solved by technology
[0004] 1. This type of probe card still cannot meet the technical requirements of the test frequency of 40GHz in the future RF device (RF device) test
[0005] 2. Due to the elastic limit of the polymer film, it is difficult for this type of probe card to compensate the error of the common plane of the object under test, which will make it difficult for this type of probe card to be used in multi-DUT testing (multi-DUT Die Under Test testing )
[0006] 3. The cost of this type of probe card is too high, and its price is about 2 to 3 times that of the current traditional probe card
Method used
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Embodiment Construction
[0034] A preferred embodiment of the method of the present invention includes the following steps:
[0035] 1. Prepare a substrate 10 of non-magnetic material, and place the substrate on a magnet plate 20; sprinkle nanotubes or nanowires 30 with high conductivity on the substrate, such as carbon nanotubes and nanowires. Such as Figure 1A As shown; and then use evaporation, sputtering or electroplating technology to coat the nanotubes or nanowires 30 with magnetically conductive materials, such as iron, nickel, etc., so that the nanotubes or nanowires 30 have magnetic permeability, and the magnet The magnetic field of the plate 20 stands on the substrate 10 respectively, such as Figure 1B Shown.
[0036] 2. Inject a liquid polymer resin material 40 with a predetermined viscosity, such as epoxy resin material, polyamide (polyamide), polymethyl methacrylate (PMMA), polystyrene (polystyrene) or PC equal to the substrate 10 , Make it wrap the nanotubes or nanowires 30 and fill the sp...
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The production method of high conductive nano film probe card includes the following steps: firstly, vertically arranging several nano tubes or nano wires on one face of a base plate; filling high-molecular resin material with predefined viscosity between nano tubes or nano wires and solidifying to form a high conductive nano film, said film has first end connected on said base plate and second end positioned on the position of opposite end of the first end; removing partial high-molecular material from second end place of said film; removing said base plate, at the same time preparing a ceramic base plate, one face of said base plate has several conductive connecting points, its another face has several metal projections; assembling said film on said ceramic base plate, making the preset nano tubes or nano wires of said first end be contacted on the conductive connecting points of said ceramic base plate; using etching process to respectively form recessed holes on position of second end said film, said recessed holes are correspondent to said metal projections, and respectively filling a metal projection on every recessed hole.
Description
Technical field [0001] The present invention relates to a method for manufacturing probe cards for measuring electronic components, in particular to a method for manufacturing a highly conductive nano-film probe card. Background technique [0002] According to this, the probing technology of electronic components in the future will face technical challenges such as ultra fine pitch, area array testing, high frequency, and low cost. [0003] At present, the commercialized probe test technology is mainly divided into two categories in high frequency testing. One is coaxial probe card and ceramic blade probe card, and the other is A membrane probe card, as disclosed in US Patent No. 5090118. Among them, the first type of probe card is to manually assemble and fix coaxial probes or ceramic blade probes on a printed circuit board (PCB). It is bound to fail to meet the requirements of ultra fine pitch in the future, and its test frequency can only reach 2 to 3 GHz. The second type of p...
Claims
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IPC IPC(8): B82B3/00G01R1/02G01R1/06H01B5/14H01B13/00
Inventor 王宏杰黄雅如周敏傑
Owner IND TECH RES INST