Cooling apparatus

A cooling device and electronic device technology, applied in the direction of instruments, electrical digital data processing, electrical components, etc., can solve the problem of little contribution of the computer system and achieve the effect of stable operation

CN1302356CInactive Publication Date: 2007-02-28WISTRON CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Publication Date
2007-02-28
Estimated Expiration
Not applicable · inactive patent

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Abstract

The present invention discloses one kind of cooling device set inside casing of electronic equipment to cool the whole system inside the casing. The electronic equipment has one tail part with at least one electronic part. The cooling device includes one refrigerating chip with cold surface adhered to the casing of the electronic equipment and hot surface; one metal frame configured inside the casing of the electronic equipment and coupled to the cold surface to conduct the cold airflow. The cold airflow convects with the heat the electronic elements inside the casing to carry the heat to the tail of the casing. The metal frame matching with the fan can dissipate the heat of all the electronic parts inside the electronic equipment.
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Description

technical field

[0001] The present invention relates to cooling devices, and more particularly to cooling devices for use in computer systems. Background technique

[0002] Each central processing unit (Central Processor Unit, CPU) has its heat-generating power. Today, as the speed of the CPU is getting faster and faster, the relative required power is also increasing. It can be predicted that in the near future, the power of the CPU will soon exceed 100 watts (Watt). At such high power, the computer system can become unstable due to the heat generated by the CPU.

[0003] Please refer to FIG. 1 , which shows a structure diagram of a conventional computer CPU cooling device. The existing cooling device 10 used in the CPU 16 of a computer includes a thermoelectric cooler (TEC) 11 . The cold side of the cooling chip 11 is coupled to the cold side heat sink 12 , such as a heat conducting material or compound, and the hot side is coupled to the hot side heat sink 14 . Wherei...

Examples

Embodiment Construction

[0035] In order to enable those skilled in the art to better understand the spirit of the present invention, before describing various embodiments of the present invention, the principle of a thermoelectric cooler (TEC) is briefly introduced. Please refer to FIG. 2 , which shows a schematic structural diagram of a cooling chip that can be used in an embodiment of the present invention. The cooling chip 31 is composed of many semiconductor particles such as N-type semiconductor 36 and P-type semiconductor 38 arranged at intervals, and the material of these semiconductor particles is usually bismuth telluride. These semiconductor particles are connected by a metal conductor 34 to form a complete circuit, and the material of the conductor 34 is, for example, copper, aluminum or other metal conductors. Finally, two insulators 32 such as ceramic sheets sandwich the circuit formed by the entire semiconductor particle and the metal conductor 34 . The insulator 32 must be insulated an...