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Integrated storage with storage unit having magnetic resistance storage effect

A storage unit and memory effect technology, which is applied in the field of integrated memory with magnetoresistive storage effect in the storage unit, and can solve the problems of inability to test the storage unit, adverse effects of the reading or writing process, and hindering the function of the storage unit.

Inactive Publication Date: 2002-02-27
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The short also affects other memory cells along that column or row line
In addition, in the functional test, due to a short circuit of a memory cell, it will not be possible to test other memory cells along the relevant line.
When repairing a memory with damaged memory cells, this problem cannot be overcome by replacing a single associated row or column line, since the short would still interfere with the function of the memory cell of other associated lines
In addition, the remaining short can cause parasitic currents on other lines, which can adversely affect the read or write process

Method used

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  • Integrated storage with storage unit having magnetic resistance storage effect

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Embodiment Construction

[0018] All known GMR / TMR elements are suitable as the memory cell as long as their resistance is higher than that of the column and row lines. Here the column lines are labeled bitlines BL0-BLn, and the row lines are labeled wordlines WL0-WLm. Here, the memory has an example number of word lines and bit lines. The memory cells MC arranged in the matrix-shaped memory cell region 1 are connected between one of the bit lines BL0 BLn and one of the word lines WL0 WLm, respectively.

[0019] In order to write information or data signals into one of the memory cells MC, the correspondingly connected bit and word lines are connected to respective current sources, not shown in the figure. A superimposed magnetic field is generated in the vicinity of the intersection of the wires at which the associated memory cell MC is located by means of a current flowing through the corresponding wire, which sets the magnetic layer of the associated memory cell to a certain state. In this case, t...

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Abstract

The present invention relates to an integrated memory comprising memory cells (MC) with magneto-resistive memory effect, which is each connected between one column line (Blo to BLn) and one row line (Wlo to WLm). The row lines (WL2) are connectable with a terminal for a selection-signal (Gno) to read out a data signal (DA) from one of the memory cells (MC3), or to write a data signal (DA) in one of the memory cells (MC3) through the column line (BL2) connected with the memory cell (MC3). One or more column lines (Blo to BLn) not connected with the memory cell (MC3) are so controllable that, to read or write the data signals (DA), they are electrically isolated in the read amplifier (3). Therefore, in case of an existing faulty memory cell (MC2), it is possible to orderly read or write the data-signals (DA) of the memory cell (MC3).

Description

technical field [0001] The present invention relates to an integrated memory whose memory cells have a magnetoresistive memory effect, said memory cells are respectively connected between one of a plurality of column lines and one of a plurality of row lines, wherein said column The line is connected to the sense amplifier, and the row line can be connected to the terminal of the selection signal, so as to read the data signal of one of the memory cells through the column line connected to the memory cell, or write data to one of the memory cells Signal. Background technique [0002] In order to store data signals, memory cells with a magnetoresistive memory effect usually have a state-variable ferromagnetic layer. This memory effect is generally known as the so-called GMR (giant magnetoresistance) effect or TMR (tunnel magnetoresistance) effect. Here, the resistance of such memory cells depends on the magnetization in the ferromagnetic layer. [0003] Memories with memor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G11C11/14G11C11/15G11C29/04H10B20/00
CPCG11C11/15
Inventor P·佩赫米勒
Owner INFINEON TECH AG