Embedded IC module

Abstract

The invention is an embedded IC module comprising a circuit board which one or more than one concave contain space are set on, at least an IC which is connected with the circuit board and can be contained in the contain space, thus to reduce thickness greatly and make it more suitable for small space. The smaller product can be produced by limited production technololy since that simple structuremakes the join of circuit board and IC arriving minimum thickness.

Description

technical field [0001] The invention relates to an electronic component, in particular to an embedded integrated circuit component. Background technique [0002] With the rapid development of the electronic technology industry, the degree of electronization in daily life is relatively increasing year by year. However, due to the limitation of production technology, the thickness of electronic parts cannot be effectively reduced. Therefore, some electronic products need to be relatively large. volume of. [0003] Figure 11 It shows the front view of the traditional electronic parts. An integrated circuit 2 is respectively arranged on both sides of the circuit board 1, and the pins 3 of the two integrated circuits 2 are respectively bonded to the two sides of the circuit board 1. The thickness of the traditional circuit board is About 1.2 times the integrated circuit, the thickness of this traditional electronic part is about an integrated circuit thickness K plus a circuit ...

AI Technical Summary

Problems solved by technology

[0002] With the rapid development of the electronic technology industry, the degree of electronization in daily life is relatively increasing year by year. However, due to the limitation of production technology, the thickness of electronic parts cannot be effectively reduced. Therefore, some electronic products need to be relatively large. volume of

[0003] Figure 11 It shows the front view of the traditional electronic parts. An integrated circuit 2 is respectively arranged on both sides of the circuit board 1, and the pins 3 of the two integrated circuits 2 are respectively bonded to the two sides of the circuit board 1. The thickness of the traditional circuit board is About 1.2 times the integrated circuit, the thickness of this traditional electronic part is about an integrated circuit thickness K plus a circuit board thickness 1.2K plus an integrated circuit thickness K=3.2K (K is the thickness of the integrated circuit), which is not effective Reducing the thickness of electronic parts requires a larger space, which relatively increases the volume of electronic products, thereby limiting the miniaturization of products. This is a shortcoming of traditional electronic parts

[0004] Fig. 12 shows the front view of another traditional electronic part, which includes a circuit board 4 and an integrated circuit 5. The bottom end of the integrated circuit 5 is fixed on the circuit board 4 by a plurality of tin balls 6, wherein the whole The total height is integrated circuit 5 + solder ball 6 + circuit board 4. Therefore, this conventional structure cannot effectively reduce its volume and height, so it cannot be applied to light, thin and short electronic products. This traditional Various deficiencies in electronic components, it is necessary to develop and improve

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