Cooling and heating device using thermoelectric module

A thermoelectric module and heating device technology, applied in lighting and heating equipment, machines using electric/magnetic effects, manufacturing/processing of thermoelectric devices, etc., can solve the problem of uneven cooling and heating performance, reducing the reliability of traditional thermoelectric modules, Problems such as uneven torque

Inactive Publication Date: 2003-08-13
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] As a result, the performance of the thermoelectric module is reduced, and its life is also shortened, thereby reducing the reliability of the conventional thermoelectric module
[0013] Also, a conventional cooling and heating device using a thermoelectric module has a structure in which the thermoelectric module is installed in a partition wall, wherein the thermoelectric module is attached to a thin aluminum plate, and the heat radiation member is attached to the aluminum plate by screws, so that the composition It is difficult to integ...

Method used

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  • Cooling and heating device using thermoelectric module
  • Cooling and heating device using thermoelectric module
  • Cooling and heating device using thermoelectric module

Examples

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Embodiment Construction

[0032] The preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings, in which the same reference numerals denote the same elements throughout. The embodiments are described below in order to explain the present invention by using the figures.

[0033] figure 2 and 3 is a view of a cooling and heating device employing a thermoelectric module consistent with the first embodiment of the present invention, figure 2 is the longitudinal sectional view of the cooling and heating device, image 3 is along figure 2 A cross-sectional view taken along the line III-III.

[0034] Such as figure 2 As shown, the cooling and heating device using a thermoelectric module includes a thermoelectric module 20, a heat radiation element 21 in contact with the heat radiation side of the thermoelectric module 20, a heat conduction block 22 in contact with the heat absorption side of the thermoelectric element 20, and a The me...

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Abstract

A cooling and heating apparatus using a thermoelectric module, in which the thermoelectric module, a heat emitting member and a heat conducting block are integrated into a single unit, to improve the performance and durability of the thermoelectric module. The cooling and heating apparatus includes a thermoelectric module. The heat emitting member is attached to a first surface of the thermoelectric module. The heat conducting block is attached to a second surface of the thermoelectric module. The heat absorbing member is attached to the heat conducting block. A cover integrates the thermoelectric module and the heat conducting block into the single unit by fixedly covering side surfaces of the thermoelectric module and the heat conducting block and a part of an inner surface of the heat emitting member.

Description

technical field [0001] The present invention generally relates to a cooling and heating device using a thermoelectric module, and more particularly to a cooling and heating device using a thermoelectric module, wherein the thermoelectric module, that is, a heat radiation member and a heat conduction member are integrated into a single Integral and thus can be easily assembled with other constituent parts while being sealed, thereby improving the performance and durability of the thermoelectric module. Background technique [0002] A thermoelectric module is one that is formed by bonding two dissimilar metals together or connecting an n-type semiconductor with a p-type semiconductor. A feature of a thermoelectric module is that when an electric current is applied thereto, heat absorption and heat emission occur on opposite surfaces of two different metals or n-type semiconductor and p-type semiconductor, respectively. As a result, if the heat exchanger is installed on the he...

Claims

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Application Information

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IPC IPC(8): F24F1/00F25B21/02H01L23/36H01L23/38H01L23/40H01L35/30H01L35/34
CPCH01L35/30H01L2924/0002F25B2500/09F25B2500/06F25B2321/023F25B21/02H10N10/13H01L2924/00
Inventor 朴来垠李在昇李洙一
Owner SAMSUNG ELECTRONICS CO LTD
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