Cooling and heating device using thermoelectric module

Abstract

A cooling and heating apparatus using a thermoelectric module, in which the thermoelectric module, a heat emitting member and a heat conducting block are integrated into a single unit, to improve the performance and durability of the thermoelectric module. The cooling and heating apparatus includes a thermoelectric module. The heat emitting member is attached to a first surface of the thermoelectric module. The heat conducting block is attached to a second surface of the thermoelectric module. The heat absorbing member is attached to the heat conducting block. A cover integrates the thermoelectric module and the heat conducting block into the single unit by fixedly covering side surfaces of the thermoelectric module and the heat conducting block and a part of an inner surface of the heat emitting member.

Description

technical field [0001] The present invention generally relates to a cooling and heating device using a thermoelectric module, and more particularly to a cooling and heating device using a thermoelectric module, wherein the thermoelectric module, that is, a heat radiation member and a heat conduction member are integrated into a single Integral and thus can be easily assembled with other constituent parts while being sealed, thereby improving the performance and durability of the thermoelectric module. Background technique [0002] A thermoelectric module is one that is formed by bonding two dissimilar metals together or connecting an n-type semiconductor with a p-type semiconductor. A feature of a thermoelectric module is that when an electric current is applied thereto, heat absorption and heat emission occur on opposite surfaces of two different metals or n-type semiconductor and p-type semiconductor, respectively. As a result, if the heat exchanger is installed on the he...

AI Technical Summary

Problems solved by technology

[0012] As a result, the performance of the thermoelectric module is reduced, and its life is also shortened, thereby reducing the reliability of the conventional thermoelectric module

[0013] Also, a conventional cooling and heating device using a thermoelectric module has a structure in which the thermoelectric module is installed in a partition wall, wherein the thermoelectric module is attached to a thin aluminum plate, and the heat radiation member is attached to the aluminum plate by screws, so that the composition It is difficult to integrate parts into a single whole, so the torque applied to the screws when assembling the component parts is not uniform, causing uneven cooling and heating performance of the device

[0014] Moreover, the above-mentioned structure of the conventional cooling and heating device also increases the thermal resistance of the conventional cooling and heating device, so that the heat generated by the thermoelectric module is not smoothly transferred to the heat radiation member, thereby destroying the performance of the conventional cooling and heating device.

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