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Semiconductor device and mfg. method thereof

A semiconductor and device technology, applied in the field of semiconductor devices and their manufacturing, can solve problems such as insufficient adhesion

Inactive Publication Date: 2003-08-13
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, oxygen plasma treatment alone is not sufficient to improve adhesion

Method used

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  • Semiconductor device and mfg. method thereof
  • Semiconductor device and mfg. method thereof
  • Semiconductor device and mfg. method thereof

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Embodiment Construction

[0023] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0024] A semiconductor device of the present invention comprises: a substrate with a light-receiving or light-emitting element; a condenser lens equipped on the aforementioned element; a first transparent layer planarized covering condenser lens positioned on the condenser lens; A light-transmitting optical element formed on the layer; a second transparent layer inserted between the first transparent layer and the optical element; wherein the first transparent layer is made of a fluorine-containing compound, so that the first transparent layer has an Refractive index, and the second transparent layer has lower water and oil repellency than the first transparent layer.

[0025] There is no particular limitation on the semiconductor substrate used in the semiconductor device of the present invention, but generally used substrates should be capable of forming light-receiving or emitting elements thereon. Examples of the s...

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Abstract

A semiconductor device comprising: a semiconductor substrate having a light receiving or emitting element; a condenser lens provided above the element; a first transparent film provided on the condenser lens for planarization over the condenser lens; a light-transmittable optical element provided above the first transparent film; and a second transparent film interposed between the first transparent film and the optical element; wherein the first transparent film is comprised of a fluorine compound so that the first transparent film is lower in refractive index than the condenser lens and the second transparent film is lower in water- and oil-repellent properties than the first transparent film.

Description

field of invention [0001] The invention relates to a semiconductor device and a manufacturing method thereof. The present invention specifically relates to a device with a condenser lens that can be used for solid-state imaging, such as semiconductor devices such as CCD (charge-coupled device), liquid crystal display device, and a manufacturing method of the device. Background technique [0002] Solid-state imaging devices such as CCDs and MOS (Metal Oxide Semiconductor) imaging devices are used in various applications such as digital still cameras, television cameras, mobile phones with imaging functions, scanners, digital copiers, and facsimile machines. As these products are widely used, there are corresponding demands to improve the functions of the solid-state imaging devices (increase the pixels and improve the photosensitivity), reduce the size and reduce the price. Due to the reduction in size of solid-state imaging devices and the increase in pixels, the size of ea...

Claims

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Application Information

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IPC IPC(8): G02B3/00G02B5/20H01L21/00H01L27/14H01L27/148H01L29/76H01L31/0203H01L31/0232H01L31/10H01L31/18H01L33/00H01L33/20H01L33/58H04N5/335H04N5/369
CPCH01L27/14806H01L27/14625H01L27/14627H01L27/14685H01L27/146
Inventor 仲井淳一
Owner SHARP KK