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Image sensor single-layer conductor rest secondary semi-etching mfg. method and packaging structure thereof

An image sensor and lead frame technology, which is applied in radiation control devices, semiconductor/solid-state device manufacturing, image communication, etc., can solve problems such as affecting the transmission of fine sensing signals, not easy to ensure good product quality, and difficult manufacturing processes. , to achieve the effect of avoiding the mechanical stamping production process, ideal practical effect, and quality assurance

Inactive Publication Date: 2003-10-29
谢志鸿
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this stacking method involves the dimensional accuracy of the upper and lower layers of templates 81, 82. For image sensor chip packaging with a small area, a large number of pins 84, 85, delicate pins, and high precision requirements, this preparation The process is also difficult, and it is not easy to ensure good product quality; moreover, the contact resistance of the two lead frame templates 81, 82 is also a problem, and it is not easy to control it to a uniform level, which will affect the effect of micro-sensing signal transmission. Need for improvement

Method used

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  • Image sensor single-layer conductor rest secondary semi-etching mfg. method and packaging structure thereof
  • Image sensor single-layer conductor rest secondary semi-etching mfg. method and packaging structure thereof
  • Image sensor single-layer conductor rest secondary semi-etching mfg. method and packaging structure thereof

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Embodiment Construction

[0025] refer to Figure 1 to Figure 5 As shown, the present invention relates to a method for preparing a single-layer lead frame of an image sensor by secondary half-etching and its packaging structure.

[0026] Such as Figure 5 As shown, the structure of the image sensor of the present invention includes: a sensing chip 1, a single-layer lead frame 2 and a glass cover plate 4; the lead frame is provided with a chip holder 21 and several pins 22, each pin 22 is surrounded The periphery of the chip holder 21 is defined as an inner lead (inner lead) 221, which is used to connect the signal contact of the sensing chip 1, and the outer edge of each pin 22 extending to the lower edge of the package is defined as an outer lead (outlead) 222, which It is an SMT pin used for soldering an external printed circuit board to transmit electrical signals; the sensing chip 1 is pasted on the top surface of the chip holder 21, and the top surface of each internal pin 221 is connected with ...

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Abstract

A package of image sensor is composed of sensor chip, single-layer wiring body with chip holder and pins, glass cover plate, and plastics for sealing. Its preparing process includes semi-etching on top surface of plate substrate to form chip holder and pins, semi-etching recess structure, inlay plastics by moulding for electric isolating, electroplating the etched wiring body, inlaying it in premould, adhering sensor chip to its holder, soldering leading wires of pins, and adhering glass cover plate.

Description

technical field [0001] The invention relates to an image sensor, in particular to a method for preparing a single-layer lead frame of an image sensor with a two-time half-etching preparation method and a packaging structure thereof for manufacturing a three-dimensional structure of a chip holder and pins. Background technique [0002] refer to Figure 6 to Figure 9 As shown, it is an existing image sensor (Image sensor) packaging technology, and the existing lead frame (Lead frame) manufacturing method is punching or stacking. Among them, the stamping method is to etch the position and shape of the die pad 71 and each lead 72 on the flat conductor substrate, and then punch the die pad 71 from the bottom to make it float out. pin 72 plane. In addition, the stamping method also has the method of directly stamping the conductor plate, and directly punching out the three-dimensional structure of the chip holder 71 and each pin 72, but both of these methods need to be processed ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H01L21/56H01L21/58H01L21/60H01L21/98H01L23/48H01L27/146
CPCH01L2224/48091H01L2224/48247H01L2924/01078H01L2924/16195
Inventor 王鸿仁
Owner 谢志鸿
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