Base-board conveying device

A technology for conveying devices and substrates, which is applied in the direction of support structure installation, rack/frame structure, electrical components, etc., and can solve the problems of low efficiency and difficult operation during operation time

Inactive Publication Date: 2003-11-12
HIROSE DENSHI SYST
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0006] In order to solve the above-mentioned problems, the inventions according to claims 1 to 4 provide a substrate transfer device having the following improved structure in view of the problems of the work space, work time efficiency and difficulty in work in the above-mentioned background art device, wherein: On the support rods in the support frame assembled by the support rods extending along the ridgelines of the faces of the cube hexahedron in a typical manner along the polyhedron, the position adjustment of the plurality of support plates is carried out in a freely slidin

Method used

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Embodiment Construction

[0017] Refer below Figure 1 ~ Figure 4, to describe preferred embodiments for realizing the present invention. For example, in such a manner that six open faces 10a1, 10a2, 10a3, 10a4, 10a5, and 10a6 corresponding to the six faces of a dice, which are one of the hexahedrons, are formed, aluminum alloys extending along the ridgelines of the six faces are formed. Support rods 10b formed of plastic, resin pipes, etc. are assembled into the support frame 10. Among the above-mentioned support rods 10b, the support rods 10b extending along the upper ridgelines of the four adjacent open surfaces 10a, 10a2, 10a3, and 10a4 in the horizontal direction constitute the upper support rods 10b1U, 10b2U, 10b3U, and 10b4U. . Similarly, the lower support bars 10b1B, 10b2B, 10b3B, and 10b4B are constituted by the support bars 10b extending along the lower ridgelines of the four open surfaces 10a1, 10a2, 10a3, and 10a4 among the above-mentioned support bars 10b. In a vertical posture bridging...

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Abstract

This invention relates to a conveying device for conveying printed circuit board with packed electronic devices from one place to another place, which has increased accumulation density and is convenient for operation to of board. The support frame is formed from six open faces being as the six-surfaces of a cube by a support rod. Between the upper rod and the lower rod there is pair of support board opposite each other which are halfly fixed or firmly fixed at anbitrary place. Between a pair of support rod, multiple horizontal base boards can be carried in multi-layer mode along the vertical direction. A support frame carrying mechanism fitted at the lowe part of the lower support rod can carry the support frame in the mode of relative motion to floor FL.

Description

technical field [0001] The present invention relates to a substrate transfer device for transferring printed circuit boards (hereinafter referred to as substrates) packaged with electronic components from one position to another position on a production line of electronic devices and the like, and further to other production lines or other facilities When moving, a large number of substrates are carried uniformly, and these substrates are conveyed along the floor surface. In particular, the present invention relates to an improvement of a substrate conveying device that increases the cumulative carrying density of the substrates and facilitates processing with a high cumulative carrying density. It is easy to carry out the transportation of substrates in different states, and it is easy to realize operational contact with the accumulated substrates from multiple aspects, and it is possible to continuously cope with the size difference of each type of substrates accumulated and ...

Claims

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Application Information

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IPC IPC(8): H05K7/14H05K7/18H05K13/00
CPCH05K13/0069
Inventor 三浦好美
Owner HIROSE DENSHI SYST
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