Checking method and checker for thin film loading band for encasulating electronic part

A technology for electronic components and inspection devices, applied in the direction of using optical devices, measuring devices, electrical components, etc., can solve the problems of easy leakage, deviation in judgment, and leakage of film carrier tape for packaging of defective electronic components.

Inactive Publication Date: 2004-05-26
MITSUI MINING & SMELTING CO LTD
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, since such marks are provided near both ends of the electronic component packaging film carrier tape, it is easy to miss them in visual inspection by humans, and since it is based on human judgment, it is difficult to judge In any case, there are deviations, it is difficult to perform stable quality inspection, and there is a danger of missing defective film carrier tapes for electronic component packaging

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Checking method and checker for thin film loading band for encasulating electronic part
  • Checking method and checker for thin film loading band for encasulating electronic part
  • Checking method and checker for thin film loading band for encasulating electronic part

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] Hereinafter, embodiments (examples) of the present invention will be described with reference to the drawings.

[0020] figure 1 It is a front view of the inspection apparatus of the film carrier tape for electronic component packaging of this invention.

[0021] Such as figure 1 As shown, 10 represents the whole inspection apparatus of the film carrier tape for electronic component packaging of this invention.

[0022] Such as figure 1 As shown, an inspection device 10 (hereinafter simply referred to as 'inspection device 10') of a film carrier tape for packaging electronic components includes a feeding device 20, an inspection unit 30, a marking unit 60, and a winding device 50. In the delivery device 20, there is a film carrier tape for electronic component packaging (hereinafter referred to as "film carrier tape"), and the roll R of the film carrier tape T that has completed the manufacturing process is wound up through the separator S and is attached to the d...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The present invention relates to an inspection method and an apparatus of film carrier tape for mounting electronic parts, which are used for inspecting poor marks such as alignment mark for determining the assembling position in mounting IC electronic parts, a land for holding the tape without additional procedures and labor. The method and the apparatus of the present invention could be carried out at a low cost, in short inspecting time, and in excellent accuracy. The inspection method of film carrier tape for mounting electronic parts of the present invention comprises the steps of comparing a pattern shape of a mark pre-stored in a memory with a pattern shape of a mark input to a sensor, then judging as a poor mark if a consistency between the two pattern shapes is below a predetermined threshold value.

Description

technical field [0001] The invention relates to an inspection method of a film carrier tape for electronic component packaging and an inspection device for a film carrier tape for electronic component packaging. -BGA (Tape Ball Grid Array; Carrier Tape Grid Ball Array) tape, CSP (Chip Size Package; chip size package) tape, ASIC (Application Specific Integrated Circuit; application specific integrated circuit) tape, etc.], COF (Chip On Film ; film-based chip), double-metal (double-sided wiring) tape, multi-layer wiring tape, etc. Background technique [0002] With the development of the electronics industry, the demand for printed circuit boards that package electronic components such as IC (Integrated Circuit) and LSI (Large-Scale Integration) has increased sharply, and the miniaturization, light weight, and high performance of electronic equipment are expected, as these The packaging method of electronic components currently uses TAB (Tape Automated Bonding) tape, T-BGA (T...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60G01B11/24H01L21/66
Inventor 长谷川浩司
Owner MITSUI MINING & SMELTING CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap