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Checking method and checker for thin film loading band for encasulating electronic part

A technology for electronic components and inspection devices, applied in the direction of using optical devices, measuring devices, electrical components, etc., can solve the problems of easy leakage, deviation in judgment, and leakage of film carrier tape for packaging of defective electronic components.

Inactive Publication Date: 2004-05-26
MITSUI MINING & SMELTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, since such marks are provided near both ends of the electronic component packaging film carrier tape, it is easy to miss them in visual inspection by humans, and since it is based on human judgment, it is difficult to judge In any case, there are deviations, it is difficult to perform stable quality inspection, and there is a danger of missing defective film carrier tapes for electronic component packaging

Method used

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  • Checking method and checker for thin film loading band for encasulating electronic part
  • Checking method and checker for thin film loading band for encasulating electronic part
  • Checking method and checker for thin film loading band for encasulating electronic part

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Embodiment Construction

[0019] Hereinafter, embodiments (examples) of the present invention will be described with reference to the drawings.

[0020] figure 1 It is a front view of the inspection apparatus of the film carrier tape for electronic component packaging of this invention.

[0021] Such as figure 1 As shown, 10 represents the whole inspection apparatus of the film carrier tape for electronic component packaging of this invention.

[0022] Such as figure 1 As shown, an inspection device 10 (hereinafter simply referred to as 'inspection device 10') of a film carrier tape for packaging electronic components includes a feeding device 20, an inspection unit 30, a marking unit 60, and a winding device 50. In the delivery device 20, there is a film carrier tape for electronic component packaging (hereinafter referred to as "film carrier tape"), and the roll R of the film carrier tape T that has completed the manufacturing process is wound up through the separator S and is attached to the d...

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PUM

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Abstract

The present invention relates to an inspection method and an apparatus of film carrier tape for mounting electronic parts, which are used for inspecting poor marks such as alignment mark for determining the assembling position in mounting IC electronic parts, a land for holding the tape without additional procedures and labor. The method and the apparatus of the present invention could be carried out at a low cost, in short inspecting time, and in excellent accuracy. The inspection method of film carrier tape for mounting electronic parts of the present invention comprises the steps of comparing a pattern shape of a mark pre-stored in a memory with a pattern shape of a mark input to a sensor, then judging as a poor mark if a consistency between the two pattern shapes is below a predetermined threshold value.

Description

technical field [0001] The invention relates to an inspection method of a film carrier tape for electronic component packaging and an inspection device for a film carrier tape for electronic component packaging. -BGA (Tape Ball Grid Array; Carrier Tape Grid Ball Array) tape, CSP (Chip Size Package; chip size package) tape, ASIC (Application Specific Integrated Circuit; application specific integrated circuit) tape, etc.], COF (Chip On Film ; film-based chip), double-metal (double-sided wiring) tape, multi-layer wiring tape, etc. Background technique [0002] With the development of the electronics industry, the demand for printed circuit boards that package electronic components such as IC (Integrated Circuit) and LSI (Large-Scale Integration) has increased sharply, and the miniaturization, light weight, and high performance of electronic equipment are expected, as these The packaging method of electronic components currently uses TAB (Tape Automated Bonding) tape, T-BGA (T...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60G01B11/24H01L21/66
Inventor 长谷川浩司
Owner MITSUI MINING & SMELTING CO LTD
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