Thermally driven in-situ test structure of transverse breaking strength of film in microelectronic mechanical system

A technology of microelectronic machinery and transverse fracture, applied in the direction of strength characteristics, using stable tension/pressure testing material strength, measuring devices, etc., can solve the problem that the accuracy of measurement is greatly affected, the reading is troublesome, and it is easy to be interfered by external factors and other problems, to achieve the effect of high measurement accuracy, simple test and low voltage

Inactive Publication Date: 2004-09-08
SOUTHEAST UNIV
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Problems solved by technology

This test structure has the following disadvantages: (1) The external driving force is difficult to control and is easily disturbed by external factors; (2) The test efficiency is low; (3) The test structure occupies a large area.
In 1999RH, Kapels was the first to propose a test structure using thermal execution as the driving force source required for testing the fracture strength. He integrated the U-shaped thermal actuator and the stru...

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  • Thermally driven in-situ test structure of transverse breaking strength of film in microelectronic mechanical system
  • Thermally driven in-situ test structure of transverse breaking strength of film in microelectronic mechanical system

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Embodiment Construction

[0011] specific implementation plan

[0012] The specific structure of the embodiment of the present invention will be further described below in conjunction with the accompanying drawings:

[0013] figure 1 It is a three-dimensional schematic diagram of the test structure for measuring tensile breaking strength. On a silicon substrate material, a microelectronic processing technology is used to fabricate a device such as figure 1 In the shown structure, the beam 102 to be tested is 10 microns long and 2 microns wide, one end is connected to the fixed end 101, the other end is connected to the beam 103, and the two sides of the beam 103 are connected to the V-shaped thermal actuator heating beam 104, each There are 4 heating beams with a width of 5 microns and a length of 300 microns; the other ends of the heating beams are respectively connected to the fixed end 105 of the heating beam; the fixed ends 101 and 105 are fixed on the upper plane of the si...

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Abstract

The present invention is thermally driven in-situ test structure of transverse breaking strength of film in microelectronic mechanical system and belongs to the field of in-situ test technology in microelectronic mechanical system. The test structure includes fixing end for beam to be tested, beam to be tested, beam, V-shaped executor heating beam, fixing end for heating beam and conducting film. The beam to be tested has one end fixed to the fixing end for beam to be tested and the other end fixed to one end of the beam, the beam has its two sides connected to V-shaped executor heating beam, the V-shaped executor heating beam has its other end connected to the fixing end for heating beam, the conducting film is on the fixing end for heating beam, the fixing end for heating beam and the fixing end for beam to be tested are fixed onto the upper plane of SiN layer, and below the SiN layer there are SiO2 layer and substrate successively.

Description

technical field [0001] The invention relates to an on-line testing structure for the transverse fracture strength of a micro-electro-mechanical system (MEMS), which belongs to the technical field of on-line testing in micro-electro-mechanical systems. Background technique [0002] The traditional test structure generally does not contain a driving source, and the driving force required for testing is added. This test structure has the following disadvantages: (1) The external driving force is difficult to control, and it is easily disturbed by external factors; (2) The test efficiency is low; (3) The test structure occupies a large area. The MEMS film transverse fracture strength on-line testing structure is a new method that integrates the V-shaped thermal actuator and the beam to be tested on the same chip, and uses the V-shaped thermal actuator to drive the beam to be tested to break, thereby realizing a new method of online testing of the fracture ...

Claims

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Application Information

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IPC IPC(8): G01N3/00G01N3/08G01N35/00
Inventor 梅年松黄庆安
Owner SOUTHEAST UNIV
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