Manufacturing method of multilayer printed circuit board

Abstract

Disclosed is a method of fabricating a multi-layered PCB, wherein a plurality of circuit layers on which circuit patterns are constructed and insulating layers which are alternately positioned between the circuit layers to insulate the circuit layers from each other are severally fabricated according to different processes, and then layered with each other at once. The present invention provides a method of fabricating a multi-layered PCB, in which a copper clad laminate is drilled to create via holes therethrough in such a way that a diameter of each via hole is relatively small, and then plated with copper to plug the via holes with the copper, thereby omitting the plugging process of the via holes using paste. The insulating layers are formed in such a way that semi-hardened (b-stage) thermosetting resin layers are layered on both sides of a completely hardened (c-stage) thermosetting resin layer, thereby improving impedance balance of the insulating layer.

Description

technical field [0001] The present invention generally relates to methods of manufacturing multilayer printed circuit boards (MLBs). In particular, the present invention relates to a method of manufacturing a multilayer printed circuit board, wherein a plurality of circuit layers constituting a circuit pattern thereon and insulating layers alternately provided between the circuit layers to insulate the circuit layers from each other are respectively manufactured according to different processes , and then stack each other one at a time, which is different from the conventional assembly process. Background technique [0002] Those skilled in the art know that with the recent trend toward small, slim, highly integrated, small and portable electronic products, there is an increasing demand for finely patterned, small and small printed circuit boards (PCBs). In addition, the conventional substances used to form multilayer PCBs are replaced and the number of layers forming MLB i...

AI Technical Summary

Problems solved by technology

[0036] That is, the conventional assembly process has a disadvantage in that, when the number of layers constituting the MLB is increased, the process of forming a via hole using a laser beam, the layer lamination process, and the plating process are repeated in sequence, prolonging the manufacturing time of the MLB, and when desired It is difficult to detect the MLB during the MLB manufacture, thereby undesirably increasing the defect ratio of the MLB, thus increasing the manufacturing cost of the MLB

[0037] In addition, the conventional method of forming vias in MLB, plating the walls of the vias with copper, and filling the vias with paste to protect the copper plating on the vias has a disadvantage in that after plating the walls of the vias with copper additionally Filling process with paste

[0038] Another disadvantage of the conventional method is that the insulating layer made of insulating resin has a high resistance against the circuit layer.

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