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Electronic circuit connection structure and its connection method

A technology of electronic circuit and connection structure, applied in the connection structure of electronic circuit and its connection field, can solve problems such as plating

Inactive Publication Date: 2004-12-01
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, in order to perform solder reflow mounting together with other electronic components mounted on the circuit board, it is desirable to use the same solder material, but because the same solder material may not be plated, it may also be difficult to integrate When performing reflow soldering

Method used

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  • Electronic circuit connection structure and its connection method
  • Electronic circuit connection structure and its connection method
  • Electronic circuit connection structure and its connection method

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment

[0031] figure 1 It is a sectional view showing the connection structure of the electronic circuit in the first embodiment of the present invention. The structure of the circuit board 10 is as follows: a land portion (not shown) for mounting an electronic component (not shown) and a conductor pattern (not shown) for connecting therebetween are formed, and a surface layer formed by the conductor pattern is formed on the surface layer. Partially constituted first connection land 12 . In addition, multilayer wiring may be performed on the circuit board 10, electronic components may be incorporated inside, passive components may be formed by film formation, and the like. These structures are not particularly limited. Electronic components is a general term for passive components or semiconductor elements.

[0032] The flexible substrate 20 is composed of the following parts: a base material 22; a second connection land 24 formed by a part of a conductor pattern formed on the bas...

no. 2 Embodiment

[0049] Figure 5 It is a sectional view showing the connection structure of the electronic circuit in the second embodiment of the present invention. In this embodiment, the area of ​​the second connection land 150 of the flexible substrate 200 is composed of the following parts: the wiring conductor 130 formed corresponding to the first connection land 12 of the circuit board 10; insulating layer 140; a region where wiring conductor 130 is exposed through an opening formed in first insulating layer 140; second insulating layer 160 formed to surround at least a part of the outer periphery of this region; The second connection land 150 is formed on the surface of the first insulating layer 140 surrounded by the second insulating layer 160 and the region portion.

[0050] The circuit board 10 has a first connection land 12 at least on the surface layer, which is the same as the circuit board of the first embodiment. If the first connection land 12 of the circuit substrate 10 a...

no. 3 Embodiment

[0066] use Figure 8A to Figure 8G A method of connecting electronic circuits in the third embodiment of the present invention will be described. exist Figure 8G shows the connection structure of the electronic circuit made by the method of connecting the electronic circuit of this embodiment, but it is different from figure 1 The connection structures of the electronic circuits shown in are identical in shape.

[0067] Initially, use Figure 8G The connection structure of the electronic circuit of this embodiment will be described. The structure of the circuit substrate 300 is as follows: a land portion (not shown) for mounting an electronic component (not shown) and a conductor pattern (not shown) for connecting therebetween are formed, and then a surface layer formed by the conductor pattern is formed. A part of the first connection land 302 is formed. Furthermore, multilayer wiring may be further formed on the circuit board 300, and passive components obtained by emb...

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PUM

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Abstract

A connecting structure comprises a circuit board (10) with a first connection land (12) having a plurality of conductor patterns on the surface thereof, a second connection land (24) disposed in a position opposite to the first connection land (12) of the circuit board (10), and a flexible board (20) including an insulating layer (26) formed so as to surround at least a part of outer periphery of the second connection land (24), wherein the first connection land (12) and the second connection land (24) are bonded to each other with a bonding member (30), and the insulating layer (26) is thicker than the total thickness of the second connection land (24) and the first connection land (12). It is possible to obtain an electronic circuit connecting structure which is free from short-circuit due to running of the bonding member such as solder even with the connecting land greatly reduced in size, and its connecting method.

Description

technical field [0001] The present invention relates to a connection structure and connection method between a circuit board mounted with electronic circuit elements and a flexible substrate. Background technique [0002] In recent years, remarkable progress has been made in the enhancement of functionality, thickness reduction, weight reduction, and miniaturization of electronic devices. For example, in a mobile phone, although a camera function is added and a display screen is enlarged, the overall shape and weight remain almost unchanged from conventional ones. In order to achieve high functionality and miniaturization of electronic devices, more electronic circuits are required to be built in a limited space. In order to effectively use the limited space, instead of using only printed circuit boards as in the past, the use of flexible substrates and printed circuit boards has been increased. In the case of using flexible substrates and printed circuit substrates, it is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/14H01L21/60H05K3/32H05K3/34H05K3/36
CPCH05K3/363H05K3/321H05K2201/09909H01L24/81H01L2224/81801H05K2201/2036H05K3/3452H05K3/361H01L2924/12042H01L2924/00H05K1/14
Inventor 东田隆亮山本宪一末次大辅长冈美行今中崇新田敏也
Owner PANASONIC CORP