Substrate etching method and etching disposal device

A technology for etching processing and substrates, which can be used in optics, instruments, electrical components, etc., to solve problems such as defective products

Inactive Publication Date: 2005-02-02
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As shown in FIG. 12 (b), when an unnecessary part of a cap shape is formed on the second metal layer 8c above the first metal layer 7c, even if an insulating film is subsequently formed on the metal film, the insulating film and the metal film There will also be gaps between them, and there is a problem of defective products

Method used

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  • Substrate etching method and etching disposal device
  • Substrate etching method and etching disposal device
  • Substrate etching method and etching disposal device

Examples

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Embodiment Construction

[0060] Below, refer to Figure 1 to Figure 8 The best mode for carrying out the present invention will be described.

[0061] figure 1 One embodiment showing the first invention is a schematic side view showing an example of a schematic structure of a substrate etching processing apparatus. This etching processing apparatus is configured by connecting a jet etching processing unit 10 and an agitating etching processing unit 12 .

[0062]The jet etching processing unit 10 includes a sealed first processing tank 14 having a loading-side opening 16 and a loading-side opening 18 . Inside the first processing tank 14 , a plurality of conveying rollers 20 capable of normal and reverse rotations that support the substrate W and convey in the horizontal direction are arranged in parallel to each other along the substrate conveyance path. The substrate W is reciprocated in the processing tank 14 by these conveyance rollers 20 . In addition, above the substrate conveyance path, a p...

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PUM

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Abstract

Provided is a device where treatment tanks are not required to be so enlarged for corresponding to the enlargement of a substrate, and the defect in etching does not occur as in the case where dipping treatment is performed. The device is provided with: a first treatment tank 14; conveyance rollers 20 arranged at the inside of the first treatment tank 14 and supportingly conveying a substrate W; spray nozzles 22 arranged at the upper part of a substrate conveyance path and jetting an etching liquid toward the surface of the substrate W; a second treatment tank 28 connected to the first treatment tank 14; conveyance rollers 30 arranged at the inside of the second treatment tank 28 and supportingly conveying the substrate W; and a discharge nozzle 32 feeding the etching liquid to the surface of the substrate W carried out from the inside of the first treatment tank 14 and carried into the second treatment tank 28 and applying the etching liquid to the whole of the surface of the substrate W.

Description

technical field [0001] The present invention relates to substrate etching in which etching liquid is supplied to the surface of substrates such as glass substrates for liquid crystal display devices, glass substrates for plasma displays, printed circuit boards, and semiconductor wafers to etch a metal film formed on the surface of the substrate into a predetermined pattern. Processing method and etching processing device. Background technique [0002] As a method of supplying etchant to the surface of the substrate and etching the substrates one by one, there is a method of holding the substrate on a spin chuck, rotating the substrate around a vertical axis in a horizontal plane, and spraying the substrate from a spray nozzle. A processing method in which etching liquid is sprayed on the surface to etch the substrate; while the substrate is transported in the horizontal direction by supporting the substrate with a plurality of transport rollers, the etching liquid is sprayed...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/13C23F1/00G03F7/30H01L21/027H01L21/306H01L21/3213
CPCC23F1/08G03F7/30G02F1/1316H01L21/027H01L21/306
Inventor 铃木聪富藤幸雄
Owner DAINIPPON SCREEN MTG CO LTD
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