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Planar magnetic sputtering-multi-station film coating apparatus

A magnetron sputtering and coating device technology, which is applied in the field of electromechanical, can solve the problem of non-adjustable speed and rotation speed, and achieve the effect of good consistency of film thickness and large loading capacity of workpieces

Inactive Publication Date: 2005-05-11
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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Problems solved by technology

[0005] (3) Existing equipment also has common rotation, such as z195224085.8, etc. (such as figure 1 As shown), although the uniformity of the film has been improved to a certain extent, the ratio of their public and rotation speeds cannot be adjusted;

Method used

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Embodiment Construction

[0026] Preparation of BST (barium strontium titanate) thin film:

[0027] In the planar magnetron sputtering-multi-station coating device of the present invention, the number of workpiece clamps used is N=6, the target position is M=3, the diameter of the target is 120mm, and the center of the target is 30mm away from the center of the substrate. The selected rotation-to-revolution ratio is 5.3, and the coating time is 30 hours. Six groups of BST (barium strontium titanate) films are prepared at one time by using the device of the present invention. The thickness of the prepared BST (barium strontium titanate) films is 1 μm, and the relative deviation of the film thickness within and between sheets is less than 3%.

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Abstract

The invention was involved in plain magnetic force control sputter, namely multi-position coating machine. The machine consist of target of plain magnetic force control sputter (14), workpiece holder (15), heater (28), aeration vent (29), evacuated chamber (30), vacuum group (32), rotor plate (16), joint lever (17), small gear wheel (18), small gear wheel (19), joint lever (20), electric machine of rotation (21), electric machine of revolution (22), joint lever (23), mediate gear wheel (24), joint lever (25), large wheel (26) and joint lever (27). The method had some characteristics, such as many work position, fine metallic-membrane plating uniformity and easy to extend.

Description

Technical field: [0001] The invention belongs to the technical field of electronic machinery, in particular to a magnetron sputtering thin film preparation device in the electronic thin film preparation technology. Background technique: [0002] As we all know, the magnetron sputtering thin film preparation device in the existing electronic thin film preparation technology can realize the coating of metal, non-metal simple substance and compound, etc. However, the film area sputtered by the existing planar magnetron sputtering device is small, and the uniformity and consistency are poor, as shown in: [0003] (1) The uniform area of ​​the film sputtered by the existing magnetron sputtering equipment is relatively small; [0004] (2) In order to sputter a film with a large uniform area, it is usually necessary to make the size of the target large; [0005] (3) Existing equipment also has common rotation, such as z195224085.8, etc. (such as figure 1 As shown), although the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35
Inventor 杨传仁
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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