Semiconductor device and manufacturing method thereof

Abstract

A semiconductor chip is secured in a state deformed into a substantially cylinder shape by a coating material formed on its surface. The deformed semiconductor chip is flip-chip connected to an interposer and sealed with sealing resin onto the interposer. Solder balls are provided, as external terminals, on the other side of the interposer.

Description

technical field [0001] The present invention relates to a semiconductor device, and more particularly to a semiconductor device such as a stacked multi-chip package (MCP) or a multi-chip module (MCM) having curved semiconductor elements. Background technique [0002] In order to increase the density of semiconductor devices or to increase the speed of operation, attention has been paid to the technology of deforming and mounting an original flat semiconductor chip into a desired shape. Thinning of semiconductor chips has progressed remarkably, and semiconductor chips themselves have become easily deformed (bent). Japanese Patent Application Laid-Open No. 2001-118982 and Japanese Patent Laid-Open No. 11-345823 disclose techniques for deforming (bending) semiconductor elements and mounting them. [0003] figure 1 It is a perspective view showing a deformed semiconductor chip disclosed in JP-A-2001-118982. The semiconductor chip 1 is deformed into a cylindrical shape by bein...

AI Technical Summary

Problems solved by technology

[0006] like figure 2 As in the semiconductor chip 3 shown, when the semiconductor chip is bent and flip-chip mounted, the chip becomes thinner and weaker, so when it is connected to an interposer or when it is packaged with resin, there is a possibility that cracks will occur in the semiconductor chip.

In addition, since the semiconductor chip is deformed into an arc shape, the positional accuracy of the connection portion between the interposer and the semiconductor chip is considered to be low.

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