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Heat radiator

A heat dissipation device and heat sink technology, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of poor heat dissipation, large thermal resistance, poor thermal conductivity, etc., and achieve excellent heat dissipation and small thermal resistance Effect

Inactive Publication Date: 2005-09-14
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of heat sink is made of metal material, which has a large thermal resistance value and poor thermal conductivity, so that the overall heat dissipation effect is not good, and it cannot meet the heat dissipation requirements of high-frequency CPUs.

Method used

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  • Heat radiator
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Examples

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Embodiment Construction

[0010] The heat dissipation device of the present invention can be used for the heat dissipation of any heat-generating electronic components. The heat dissipation of a CPU is taken as an example to illustrate below.

[0011] figure 1 It is a schematic diagram of the combination of the cooling device of the present invention and the CPU40. The heat dissipation device includes a heat transfer element 10 close to the CPU 40 , a heat dissipation element 20 close to the heat transfer element 10 and a heat dissipation fan 30 mounted on the heat dissipation element 20 . The following describes each component separately.

[0012] The heat transfer element 10 is located below the CPU 40 , and one surface thereof has a good thermal connection with the CPU 40 . The heat dissipation element 20 includes a heat dissipation base 21 and a plurality of mutually parallel heat dissipation fins 22 extending downward from the heat dissipation base 21. The heat dissipation base 21 and the heat d...

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Abstract

A heat radiation device includes a heat transfer element closing to the heating element and a radiation element closing to the transfer element including a closed cavity containing a pore oxide sintered body filled with working liquids. When the heating element works, the working liquid circulates in phase transformation to transfer heat generated by the heating element to realize radiation of the heating element.

Description

【Technical field】 [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device used for heat dissipation of electronic components. 【Background technique】 [0002] In recent years, the performance of the computer central processing unit (CPU) has been continuously improved, and the computing speed has been continuously improved, and the problems to be dealt with have become more and more complicated, so that the frequency used by the CPU has increased correspondingly, and the calorific value has continued to increase. Excessively high temperature will not only affect the service life of the CPU, but also affect the normal operation of the computer. [0003] The heat dissipation of existing computer CPU mostly uses the mode of air forced cooling. Wherein the heat sink with fins is a heat dissipation element commonly used in CPU, and the heat sink includes a heat dissipation base attached to the CPU, and a plurality of heat dissipation ...

Claims

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Application Information

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IPC IPC(8): H01L23/427
Inventor 吕昌岳余泰成林志泉陈杰良
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD