Adhesive material tape, method of connecting, producing, and press-connecting the tape, adhesive material-tape reel, adhering device, adhesive agent-tape cassette, method of press-connecting adhesive

Abstract

A method of connecting adhesive material tapes, used for connecting one adhesive material tape wound on one reel and the other tape wound on the other reel, an adhesive agent being applied on base materials of the tapes. The end portion of the one adhesive material tape is turned over, and an adhesive agent face of the one adhesive material tape and an adhesive agent layer of the other adhesive material tape are laid over each other. Then, the laid over portion is heated and pressed so as to connect them. To exchange the adhesive material reels, the end portion of an adhesive material tape having been paid out and the start potion of an adhesive material tape to be newly installed are adhered to each other using the adhesive agents of the adhesive material tapes. Therefore, work including exchange of take-up tapes at every replacement of a new adhesive material tape and installation of the start portion of a new adhesive material tape to a take-up reel is not required. The replacement to a new adhesive material tape requires less time, and then productivity of electronic equipment is increased.

Description

[0001] Adhesive tape cartridge, crimping method using the same, and anisotropic conductive material tape technical field [0002] The present invention relates to an adhesive material tape for electrically connecting electrodes between electronic components and circuit boards, or between circuit boards, and its connection method, manufacturing method, crimping method, Adhesive material tape roll, bonding device, adhesive tape cassette, crimping method using adhesives thereof, especially adhesive material tape rolled into a reel and connection method thereof, manufacturing method, crimping method, Adhesive material tape roll, bonding device, adhesive tape cassette, crimping method of adhesive using them, and anisotropic conductive material tape Background technique [0003] As a method of bonding and fixing electronic components such as liquid crystal screens, PDP (plasma display screens), EL (fluorescent display) screens, and bare chip mounting to circuit boards and circuit ...

AI Technical Summary

Problems solved by technology

Therefore, the frequency of replacement of the adhesive material roll in the manufacturing factory of the electronic equipment increases, and since it takes time to replace the adhesive material roll, there is a problem that the production efficiency of the electronic equipment cannot be improved.

[0009] For this problem, some people consider increasing the number of turns of the adhesive material tape wound on the reel, thereby increasing the amount of adhesive per roll and reducing the replacement frequency of the adhesive material roll. However, due to the The bandwidth is as narrow as 1~3mm, if the number of turns increases, it may cause collapse

In addition, if the number of turns increases, the pressure acting on the adhesive material tape rolled into a tape will increase, and the adhesive may ooze from both sides of the tape, causing clogging

[0010] In addition, if the number of turns of the adhesive material tape is increased, the diameter of the roll will also increase, making it difficult to attach to existing bonding equipment, and may not be able to be used in existing bonding equipment

Images