Organic adhesive light-emitting element with ohm method lug

Abstract

The luminous element comprises a conducting base plate, a luminous lamination, a metal layer formed on the conducting base plate, a reflecting layer formed on the luminous lamination and an organic bonding layer of ohmic metal lug. The organic bonding layer of ohmic metal lug includes an ohmic metal lug and a binding material around periphery of the ohmic metal lug. The binding material binds the metal layer and the reflecting layer. The ohmic metal lug forms ohmic contact with the metal layer and the reflecting layer. The disclosed structure simplifies technique for fabricating LED.

Description

technical field [0001] The invention relates to a light-emitting diode, in particular to an organic bonding light-emitting element with ohmic metal bumps. Background technique [0002] Light-emitting diodes are widely used, for example, in optical display devices, traffic signs, data storage devices, communication devices, lighting devices, and medical devices. In this technology, one of the important issues for technicians at present is how to increase the brightness of the LED, and another important issue is how to reduce the manufacturing cost of the LED. [0003] In Taiwan Patent Publication No. 474094, a light-emitting diode and its manufacturing method are disclosed. A light-emitting diode stack is bonded to a transparent substrate by using a transparent insulating adhesive layer. Since the adhesive layer is non-conductive, this prior art method is only applicable to light-emitting diodes with two electrodes located on the same side, and cannot be applied to light-emi...

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Problems solved by technology

[0004] When the inventors of the present application considered how to solve the above-mentioned shortcomings, they obtained an inspiration for the invention. They thought that if a light-emitting laminated layer and a conductive substrate are connected by using an organic adhesive layer of an ohmic metal bump, wherein the organic adhesive layer of the ohmic metal bump The junction layer includes an ohmic metal bump and an adhesive material distributed around the ohmic metal bump, the conductive substrate and the light-emitting stack are bonded by the adhesive material, and the ohmic metal bump is respectively connected to the conductive substrate And the light-emitting stacked layer forms an ohmic contact, so that the problem that the aforementioned adhesive layer is not conductive and cannot be applied to a vertically structured light-emitting diode can be solved. At the same time, the manufacturing process does not need to go through an etching step to form electrodes, which simplifies the manufacturing process and reduces manufacturing cost

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