Thermosetting adhesive composition and adhesive band used said composition for electronic member

A technology of adhesives and compositions, applied in the fields of thermosetting adhesive compositions and adhesive tapes, can solve problems such as the inability of adhesives to obtain coupling effects

Inactive Publication Date: 2005-11-02
INNOX CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this method is more effective for improving the adhesion between the metal base and the adhesive than that between the base film made of plastic and the adhesive, and since a

Method used

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  • Thermosetting adhesive composition and adhesive band used said composition for electronic member
  • Thermosetting adhesive composition and adhesive band used said composition for electronic member
  • Thermosetting adhesive composition and adhesive band used said composition for electronic member

Examples

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Embodiment 1-18

[0085] Example 1-18 Preparation of thermosetting adhesive composition for flexible PCB

[0086] A certain amount of butadiene-acrylonitrile copolymer (A), epoxy resin (B), hardener ( C), hardening accelerator (D), silane coupling agent (E) and filler, according to the selection of table 2, mix with the methyl ethyl ketone of 70ml, make the full amount composition of the mixture that above-mentioned each component forms be 100 weight %, and then dissolved at room temperature to 50°C to prepare a solution. At this time, the solution was controlled so that the solid contained therein was 30% by weight, thereby preparing the thermosetting adhesive composition for flexible PCB of the present invention.

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Abstract

A composition for thermosetting bond is provided to improve: adhesiveness between butadiene-acrylonitrile copolymer and the substrate; compatibility with an epoxy resin; moisture resistance, chemical resistance, reliability, solder resistance, burr properties and bending properties, thereby being suitably used to an adhesive tape for electronic parts; and interfacial adhesiveness between a substrate film and the adhesive agent, thereby improving bending resistance and reliability at high temperature. The composition is suitably used to a flexible printed circuit board. The composition for thermosetting bond comprises: (1) a butadiene-acrylonitrile copolymer which contains a carboxyl polyamide aminocarbonyl group (A) and a polysiloxane aminocarbonyl group (B), and is represented by the formula 1, wherein A=(100-B), wherein each A and B is a molar ratio ranged from 1-99; each k, m and n is a molar ratio, k=1, m=3-200, and n=0.2-100; R1 and R2 are alkyl groups of C1-C20, respectively; and O, P and Q are integers between 1-20; and (2) an epoxy resin. The butadiene-acrylonitrile copolymer has a weight average molecular weight of 10000-200000, wherein the acrylonitrile unit is 2-40wt%. The composition comprises the epoxy resin with the amount of 10-900pts.wt, based on 100pts.wt of the butadiene-acrylonitrile copolymer.

Description

technical field [0001] The present invention relates to a thermosetting adhesive composition and an adhesive tape for electronic components using the composition. Specifically, the present invention relates to a thermosetting adhesive composition for flexible printed circuit boards comprising: 1) a butadiene-acrylonitrile copolymer containing carboxypolyamide aminocarbonyl groups (A) and polysilicon Oxyalkylaminocarbonyl group (B), as shown in formula 1 below, and 2) epoxy resin, and an adhesive tape using the composition for electronic components. [0002] Formula 1 [0003] [0004] (wherein, A=100-B, and A is molar ratio, is 1 to 99, k, m and n are molar ratios, and when k is 1, m is 3-200 and n is 0.2-100, R 1 and R 2 for C 1 -C 20 aliphatic hydrocarbons, R 3 for C 1 -C 20 alkyl, and O, P and Q are integers from 1 to 20, respectively) Background technique [0005] Currently, technologies related to semiconductor packaging, such as sur...

Claims

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Application Information

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IPC IPC(8): B32B27/00B32B27/34B32B27/38C09J11/06C09J125/12C09J133/20C09J147/00C09J161/06C09J161/18C09J163/00C09J177/00C09J183/04
CPCC08L61/06C08L63/00C09J7/25C09J7/255C09J109/02C09J183/04C09J2203/326C09J2467/006C09J2479/086
Inventor 张镜浩金光武权正敏李坰錄朴德夏
Owner INNOX CORP
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