Solid state imaging device and method for producing the same

Abstract

There is provided a solid-state imaging device including: a base that has a through hole penetrating therethrough from a first principal face thereof to a second principal face thereof; a solid-state imaging element whose imaging surface faces an opening on the second principal face side of the through hole and that is fixed to a peripheral region of the opening with a sealing resin; and a translucent plate that is fixed to a peripheral region of an opening on the first principal face side of the through hole with a sealing resin, wherein the peripheral region of at least one of the opening on the first principal face side and the opening on the second principal face side is roughened more than other regions of the base. Thus, a solid-state imaging device that can reduce resin bleeding, while ensuring connection reliability, is provided.

Description

technical field [0001] The present invention relates to a solid-state imaging device and a manufacturing method thereof. Background technique [0002] In recent years, optical devices using light-receiving and light-emitting elements have progressed in performance and miniaturization, and are used, for example, in automatic door opening and closing systems and remote control devices. Among them, solid-state imaging devices are widely used in fields such as medical treatment, industry, and information, and are used, for example, in electronic equipment such as mobile phones, digital still cameras, and video cameras. In recent years, along with miniaturization and thinning of electronic equipment, there is also a strong demand for solid-state imaging devices. In response to such demands, for example, Japanese Patent Laid-Open No. 2002-43554 proposes a solid-state imaging device satisfying the above demands. [0003] Figure 9 It is a cross-sectional view of the solid-state i...

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Problems solved by technology

[0005] However, the above-mentioned conventional solid-state imaging device and its manufacturing method have the following problem: the rounded end portion 35a formed in the gap between the solid-state imaging device 30 and the base 32 (refer to Figure 12 ) position control; the rounded ends 36a, 36b formed in the gap between the base 32 and the glass plate 31 (refer to Figure 12 ) position control; the solid-state imaging element 30 or the adhesion of the glass plate 31 relative to the base 32 depends on the surface state of the base 32 and the glass plate 31

[0009] In addition, the size of the rounded end portion 36a of the sealing resin 36 depends on the coating amount of the sealing resin 36 and the surface state of the glass plate 31, but it may be affected by the vibration when the glass plate 31 is loaded and the deterioration of the surface state of the glass plate 31. The opening portion of the through hole 17 forms an oversized rounded end portion 36b

In this case, in order to make the light 39 sent to the light receiving element 38 (refer to Figure 12 ) becomes larger, which may cause a peripheral notch (カケ) of the output image of the solid-state imaging device 200 and a decrease in the amount of peripheral light.

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