Optical assembly packaging structure and mfg. method thereof
A technology of optical components and manufacturing methods, which is applied in the field of packaging structure, can solve the problems of expensive ceramic substrates, etc., and achieve the effects of reducing manufacturing costs, preventing moisture, and reducing deflection
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[0013] Please refer now figure 1 , Which shows an optical component packaging structure 100 according to an embodiment of the present invention. The package structure 100 includes a chip 110 with an active surface 112 and an opposite back 114. The active surface 112 of the chip 110 has an active zone 116 with a plurality of optical components, such as optical sensors , Used for conversion between optical and electrical signals.
[0014] A sealant 122 is disposed on the active surface 112 of the chip 110 around the optical component 114. An outer cover 120 is disposed on the sealant 122, and is adhered to and fixed on the chip 110 by the sealant 122. The sealant 122 is mixed with spacers (not shown in the figure), so as to maintain a certain gap between the outer cover 120 and the chip 110. Furthermore, the outer cover 120 can be a simple transparent outer cover. Alternatively, the outer cover 120 can be used to provide optical characteristics, such as filter and focusing, that is...
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