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Optical assembly packaging structure and mfg. method thereof

A technology of optical components and manufacturing methods, which is applied in the field of packaging structure, can solve the problems of expensive ceramic substrates, etc., and achieve the effects of reducing manufacturing costs, preventing moisture, and reducing deflection

Active Publication Date: 2006-01-11
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The aforementioned optical component packaging configurations are prone to warpage and must use expensive ceramic substrates

Method used

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  • Optical assembly packaging structure and mfg. method thereof
  • Optical assembly packaging structure and mfg. method thereof
  • Optical assembly packaging structure and mfg. method thereof

Examples

Experimental program
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Embodiment Construction

[0013] Please refer now figure 1 , which shows an optical component packaging structure 100 according to an embodiment of the present invention. The package structure 100 includes a chip 110 having an active surface 112 and an opposite back surface 114. The active surface 112 of the chip 110 has an active zone 116 having a plurality of optical components, such as optical sensors. , for conversion between optical and electrical signals.

[0014] A sealant 122 is disposed on the active surface 112 of the chip 110 around the optical component 114 . A cover 120 is disposed on the sealant 122 , and is adhered and fixed on the chip 110 by the sealant 122 . The sealant 122 is mixed with a spacer (not shown in the figure), so that a certain gap is maintained between the outer cover 120 and the chip 110 . Furthermore, the outer cover 120 may be a simple transparent outer cover. Alternatively, the outer cover 120 can be used to provide optical properties, such as filter and focusing...

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PUM

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Abstract

A package unit of an optical component includes a chip, a sealing glue, a cover, a base plate, multiple connection lines and a transparent sealing colloid, among which, said chip has an optical component and multiple chip weld pads, said sealing glue is matched surrounding said optical component, said cover is matches on said sealing glue, said base plate supports the chip and has multiple weld pads, said connection lines connect the chip weld pads with those of the base plate electrically and said transparent sealing colloid is formed on the base plate and the cover and seals the connection lines.

Description

technical field [0001] The invention relates to a packaging structure of an optical integrated circuit component, in particular to a packaging structure of an optical integrated circuit component with an outer cover and transparent sealing plastic. Background technique [0002] In general optoelectronic applications, in order to protect optoelectronic components in the form of integrated circuit chips, such as image sensor chips, from physical damage and contamination from environmental impurities, the general practice is to use the The image sensor chip is placed in a package structure, and the package structure has an opening sealed by a transparent cover, so that the image sensor chip can sense optical signals. [0003] For example, the image sensor chip is typically mounted on a co-fired ceramic substrate with protruding pins using an adhesive layer. The adhesive layer generally needs to undergo a curing process to fix the image sensor component on the ceramic substrate...

Claims

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Application Information

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IPC IPC(8): H01L31/04H01L31/18
CPCY02E10/50Y02P70/50
Inventor 余国宠
Owner ADVANCED SEMICON ENG INC
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