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Thermally sensitive array devices for presence detection around automatic doors

A device and array technology, applied in the field of thermal array devices used for presence detection near automatic doors, can solve problems such as being unsuitable for steady-state temperature measurement

Inactive Publication Date: 2006-01-25
BEA SA
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Pyroelectric sensors only provide temperature change measurement and are not suitable for steady state temperature measurement

Method used

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  • Thermally sensitive array devices for presence detection around automatic doors
  • Thermally sensitive array devices for presence detection around automatic doors
  • Thermally sensitive array devices for presence detection around automatic doors

Examples

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Embodiment Construction

[0041] Referring to FIGS. 1 and 2 , a thermopile array device 80 as a thermopile device according to the present invention as shown in FIG. 2 mainly includes an array of thermopile sensors 10 schematically illustrated in FIG. 1 . Each thermopile sensor 10 is adapted to inspect or monitor a monitoring point 52 forming part of the overall monitoring area of ​​the device 80 .

[0042] When referring to an element X of a thermopile sensor as shown in FIG. 1 of the thermopile sensor array shown in FIG. Number X-i. Here, i is an integer identifying a particular thermopile sensor 10-i in the sensor array, i can assume any value from 1 to n, where n represents the number of thermopiles contained in the array.

[0043] As shown in FIG. 1, in one embodiment of the present invention, a thermopile sensor 10 includes a first source element 14 thermally coupled to a first contact 15 of a downsized thermocouple 12 and a first source element 14 thermally coupled to the thermocouple 12. The ...

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Abstract

The present invention relates to a thermally sensitive array device for detecting a presence of a target object in a surveillance area. The device comprises a plurality of at least two thermally sensitive sensors provided in an array arrangement, each thermally sensitive sensor being associated with one of a corresponding plurality of at least two surveillance spots comprised in the surveillance area. Each thermally sensitive sensor comprises a sensitive element adapted to absorb a portion of thermal infrared radiation emitted from one of said plurality of targets located inside the surveillance cone corresponding to the thermally sensitve sensor. Thermally sensitive sensor can be thermopiles, Bolometers or any other type. Electronic circuits in each thermally sensitive sensor are adaptedto measure a signal generated in the thermally sensitive sensor as a consequence of the temperatures of the target. The device may further comprise electric multiplex measurement circuitry electrically coupled to the different sensors. The device is adapted to perform differential measurements between selectable pairs of thermopile sensors, of the temperatures prevailing in the corresponding surveillance cones.

Description

technical field [0001] The present invention generally relates to a thermally sensitive array device comprising, for example, a thermopile array, providing presence and motion detection within a surveillance area comprising an array arrangement of surveillance cones, in an exemplary application of such a device as a door sensor device, Particularly suitable for providing presence and / or motion detection of objects in or near doorways, preferably for automatic door applications. Background technique [0002] In this application, the presence of a target object such as a human body is detected when, for example, entering the door sensor monitoring area triggers the door to open automatically, or when the target object is detected in the doorway, preventing the door from closing against the target object. [0003] Thermal imaging is based on the measurement of thermal radiation emitted by any object with a defined temperature. The relevant wavelength of this radiation is betw...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/00G01K7/00G05B11/00
CPCG01K17/003G01J5/14E05Y2400/44E05F15/106E05Y2800/414E05F15/2023E05Y2900/132E05F15/608E05F15/73G01V8/10G01V8/20
Inventor 艾伦·赞波
Owner BEA SA
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