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Electronic component mounting apparatus

A technology for electronic parts and installation devices, applied in the direction of electrical components, electrical components, etc., can solve the problems of inability to install and operate, reduce productivity, etc., and achieve the effect of improving productivity and simple structure

Inactive Publication Date: 2006-02-01
HITACHI HIGH TECH INSTR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, since a plurality of mounting devices perform the same operation at the same time, mounting operations cannot be performed independently. When a failure occurs in one of the mounting devices, the entire electronic component mounting device has to be stopped, reducing productivity.

Method used

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  • Electronic component mounting apparatus
  • Electronic component mounting apparatus
  • Electronic component mounting apparatus

Examples

Experimental program
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Embodiment Construction

[0028] Below, refer to Figure 1 ~ Figure 3 An electronic component mounting device according to an embodiment of the present invention will be described. This electronic component mounting apparatus 1 is composed of a supply system 3 for supplying electronic components X arranged in parallel to each other via device main bodies 2 and 2 arranged in parallel in the conveying direction of the printed wiring board Y, and an electronic component mounted on each printed wiring board Y. The X mounting system 4 is constituted, and the supply system 3 is constituted by an electronic component supply device.

[0029] Each device main body 2 is provided with: an indexing unit 6, which is mainly composed of a drive system including a driving motor; a turntable 7, which is connected to the indexing unit 6, and rotates independently and intermittently individually; The heads 8 are arranged at equal intervals on the outer periphery of the turntable 7 matching the intermittent pitch, and th...

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PUM

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Abstract

The invention performs an operation for mounting electronic components on a plurality of printed boards independently by making it possible for the suction nozzles of mounting heads provided on a plurality of rotary tables to perform mounting operation individually, and making it possible for the tables for positioning the printed boards to move individually. A component feeder 3 moves a plurality of component feeding tables 12 with a plurality of component feeding units 13 mounted therein individually in its juxtaposing direction. Each rotary table 7 rotating intermittently is provided, on the periphery thereof, with mounting heads 8 having a plurality of suction nozzles 9 for taking out electronic components individually from the component feeder 3 while spaced apart equally in accordance with the intermittent pitch. Electronic components fed individually to component take-out position are thereby taken out by the suction nozzles 9 of the mounting head 8 on each rotary table 7 in the component feeding unit 13 of each component feeding table 12 and then mounted on a printed board Y on a corresponding XY table 4A.

Description

technical field [0001] The present invention relates to an electronic component mounting device that takes out electronic components from a component supply unit using a suction nozzle provided on a mounting head, and mounts the electronic components on a printed wiring board. Background technique [0002] Such an electronic component mounting device is disclosed in Japanese Patent No. 3078614 and the like. Moreover, the following technology is also disclosed: a plurality of mounting devices that perform the same operation at the same time are arranged in parallel, and a mounting part positioning device composed of a main table and a calibration device is installed, wherein the main table moves in the horizontal direction and is positioned on the part mounting device. Position, the calibration device places the same printed circuit board on the main workbench, and can be moved separately to correspond to the above-mentioned mounting device. [0003] Patent Document 1: Paten...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/02
CPCH05K13/0478H05K13/0413H05K13/0452H05K13/0417H05K13/041H05K13/0411Y10T29/53178Y10T29/53183Y10T29/53187H05K13/02H05K13/04
Inventor 狩野良则臼井克尚竹村郁夫森谷友二山口晴彦冈本学泉原弘一藏田健士浅井顺
Owner HITACHI HIGH TECH INSTR CO LTD