Transpositional method for partial defective print circuit module in print circuit board

A technology of printed circuit boards and printed circuits, which is applied in the direction of printed circuits, printed circuit manufacturing, and assembly of printed circuits with electrical components, which can solve the problems of rising production costs of finished substrates, poor connection stability, cumbersome operations, etc., and achieve rapid replacement, Effect of reducing waste and simplifying the replacement procedure

Inactive Publication Date: 2006-02-08
梁信宏
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, not only a huge loss is caused, but also many problems such as an increase in the production cost of the finished substrate are caused.
[0003] Later, there was a practice of cutting off the bad printed circuit module on the substrate and replacing it with a good printed circuit module. However, due to technical defects, the replacement of a good printed circuit module is usually connected by glue, which not only has poor connection stability, but also Need to go through the glue injection and baking process, the operation is cumbersome and the efficiency is low

Method used

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  • Transpositional method for partial defective print circuit module in print circuit board
  • Transpositional method for partial defective print circuit module in print circuit board
  • Transpositional method for partial defective print circuit module in print circuit board

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Embodiment Construction

[0023] The present invention will be further described below in conjunction with accompanying drawing:

[0024] The present invention mainly includes the following steps: removing the defective printed circuit module in the first substrate 10; selecting the second substrate 20 with a good printed circuit module; embedding the second substrate 20 in the defective printed circuit module in the first substrate 10 The position of 10a realizes replacement. When removing the bad printed circuit module 10a of the first substrate 10, process this part into a corresponding shape and size of accommodating groove 11, and extend one or more than two embedding ports 12 on the edge of the accommodating groove 11; The base plate 20 is made as a plate body matching the shape and size of the above-mentioned receiving groove 11 , and the second base plate 20 is provided with an ear buckle 21 which is inlaid and connected with the embedding interface 12 . The ear buckle 21 and the embedded inte...

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Abstract

This invention relates to a method for displacing part of imperfect printed circuit mold in cirbuit board, belonging to printed circuit board technology field, which comprises the following steps: a, eliminating imperfect printed circuit mold in the first base plate; b, choosing a second plate with perfect molds; c, inlaying the second plate in the position of imperfect molds of the first plate, realizing displacing; d, molding the part of imperfect molds of the first plate into containing slot, matched with the second plate's shape, size, via direct close inlayment or using interface or earclip lock structure, based on the characteristic of thermal expansion and cold contraction, forming stable connection between slot and the second plate. The invention has reduced cost.

Description

Technical field: [0001] The invention relates to the technical field of printed circuit boards, in particular to a method for replacing some bad printed circuit modules in printed circuit boards. Background technique: [0002] As we all know, general printed circuit board construction such as figure 1 As shown, there are several circuit modules 51 , 52 , 53 on the upper layer of the substrate 5 for continuous layout and printing. All of the substrates 5 have several circuit modules 51, 52, 53 printed on their upper parts, and after the substrate 5 is formed, the circuit modules 51, 52, 53 on it need to be checked by operation to determine whether they are good. As a qualified finished product, if one of the circuit modules continuously typesetting on the substrate 5 is judged to be defective, other circuit modules will be discarded simultaneously. As a result, not only a huge loss is caused, but also many problems such as an increase in the production cost of the finished ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/30H05K3/00
Inventor 梁信宏
Owner 梁信宏
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