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Semiconductor laser device and manufacturing method therefor

A technology of laser device and manufacturing method, which is applied to semiconductor lasers, laser parts, lasers, etc., can solve the problems of increasing the light absorption of Au diffusion region, deterioration of emission efficiency, deterioration of characteristics of laser devices, etc., to improve heat dissipation and prevent tilting. Effect

Inactive Publication Date: 2006-03-22
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This will cause deterioration in the characteristics of the laser device
[0025] More specifically, since the p-InP cladding layer 204 includes P (phosphorus) as one of the constituent elements, in which Au is more likely to diffuse, Au diffuses into the light emitting region as time goes by, thereby increasing light absorption in the Au diffusion region, Causes deterioration of emission efficiency
Therefore, laser devices are more likely to cause reliability degradation

Method used

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  • Semiconductor laser device and manufacturing method therefor
  • Semiconductor laser device and manufacturing method therefor
  • Semiconductor laser device and manufacturing method therefor

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0069] figure 1 is a schematic cross-sectional view of the semiconductor laser device according to the first embodiment of the present invention.

[0070] Semiconductor laser devices have n-(Al 0.7 Ga 0.3 ) 0.5 In 0.5 P first cladding layer 2, quantum well active layer 3, p-(Al 0.7 Ga 0.3 ) 0.5 In 0.5 P second cladding layer 4, and p-In 0.5 Ga 0.5 P etch stop layer 5, and these layers are stacked in this order on a substrate such as n-GaAs substrate 1. n-(Al 0.7 Ga 0.3 ) 0.5 In 0.5 P first cladding layer 2, quantum well active layer 3, p-(Al 0.7 Ga 0.3 ) 0.5 In 0.5 P second cladding layer 4, and p-In 0.5 Ga 0.5 The P etch stop layer 5 forms an example of a compound semiconductor layer.

[0071] The quantum well active layer 3 consists of two layers of In 0.5 Ga 0.5 P well layer, one layer (Al 0.7 Ga 0.3 ) 0.5 In 0.5 P barrier layer, and two layers (Al 0.7 Ga 0.3 ) 0.5 In 0.5 The P waveguide layer is formed.

[0072] Set on the etch stop layer 5 ...

no. 2 example

[0097] image 3 is a schematic cross-sectional view of a semiconductor laser device according to a second embodiment of the present invention.

[0098] Semiconductor laser devices have n-(Al 0.7 Ga 0.3 ) 0.5 In 0.5 P first cladding layer 2, quantum well active layer 3, p-(Al 0.7 Ga 0.3 ) 0.5 In 0.5 P second cladding layer 4, and p-In 0.5 Ga 0.5 P etching stop layer 5, these layers are stacked in this order on n-GaAs substrate 1 as an example of the substrate. n-(Al 0.7 Ga 0.3 ) 0.5 In 0.5 P first cladding layer 2, quantum well active layer 3, p-(Al 0.7 Ga 0.3 ) 0.5 In 0.5 P second cladding layer 4, and p-In 0.5 Ga 0.5 The P etch stop layer 5 forms an example of a compound semiconductor layer.

[0099] The quantum well active layer 3 is composed of two layers of In 0.5 Ga 0.5 P well layer, one layer (Al 0.7 Ga 0.3 ) 0.5 In 0.5 P barrier layer, and two layers sandwiching the well layer and the barrier layer (Al 0.7 Ga 0.3 ) 0.5 In 0.5 P waveguide la...

no. 3 example

[0134] Figure 5 A schematic cross-sectional view of a semiconductor laser device according to a third embodiment of the present invention is shown. exist Figure 5 in, with image 3 The same components in the second embodiment shown are passed with the image 3 are represented by the same reference numerals, and their descriptions are omitted.

[0135] This semiconductor laser device differs from that of the second embodiment in that a plating electrode 35 of an Au plating film as an example is formed on a p-side electrode 31 .

[0136] The manufacture of the semiconductor laser device of this embodiment produces the same effects and advantages as those of the semiconductor laser device of the second embodiment. Also, since the plating electrode 35 is formed on the p-side electrode 31, good heat dissipation is obtained, enabling high temperature, high output operation with improved reliability.

[0137] Furthermore, instead of the dielectric film 21 having poor thermal c...

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Abstract

The invention discloses a semiconductor laser device and manufacturing method therefor. In the semiconductor laser device, a first cladding layer ( 2 ), a quantum well active layer ( 3 ), a second cladding layer ( 4 ), and an etching stopper layer ( 5 ) are sequentially stacked in this order on a substrate ( 1 ). On the etching stopper layer ( 5 ) is disposed a striped ridge portion ( 11 ) that is composed of a third cladding layer ( 14 ) and a contact layer ( 6 ). A p-side electrode ( 31 ) is provided on the ridge portion ( 11 ). Side faces of the ridge portion ( 11 ) except the contact layer ( 6 ) are covered with a dielectric film ( 21 ). The contact layer ( 6 ) has a layer thickness larger than a film thickness of a portion of the dielectric film ( 21 ) that is roughly parallel to the substrate ( 1 ).

Description

technical field [0001] The invention relates to a semiconductor laser device and a manufacturing method thereof. Background technique [0002] In general, the ridge waveguide structure is a structure known to effectively perform current confinement and light confinement in semiconductor laser devices. In the ridge waveguide structure, a stripe-shaped ridge portion is formed on a compound semiconductor layer on a semiconductor substrate, and a dielectric film (buried layer) is formed on both sides of the ridge portion. The upper portion of the ridge portion is formed by the contact layer. An excitation electrode, such as an ohmic electrode, for injecting current into the ridge portion is connected to the flat top surface of the contact layer. [0003] For a semiconductor laser device having such a ridge waveguide structure, in terms of lateral mode control of laser oscillation, it is necessary to ensure that the sides of the ridge portion are covered with a dielectric film ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/22H01S5/042
CPCH01S5/0425H01S5/22H01S5/34326B82Y20/00H01S5/3436H01S5/0421H01S5/2205H01S5/04252H01S2301/176H01S5/04254H01S5/02476
Inventor 近藤正树
Owner SHARP KK