Near-end crosstalk compensation at multi-stages
A technology of crosstalk and substrate, applied in coupling devices, printed circuit components, two-component connection devices, etc., can solve the problems of low frequency tolerance deterioration and high frequency tolerance deterioration.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0019] The examples shown in the drawings will now be described in detail with reference to the preferred embodiments of the present invention. In this application, "level" refers to the location where the compensation occurs at the compensation delay point.
[0020] The present invention provides printed circuit boards (PCBs) of various configurations that can replace the printed circuit board of Figure 7A of the '358 patent. In some embodiments, the PCB of the present invention is constructed by laminating a plurality of substrates with different dielectric constants (DK).
[0021] According to the first embodiment of the present invention, FIG. 1( a ) is a side view of the connector, and FIG. 1( b ) is a top plan view of the printed circuit board and compensation capacitor of FIG. 1( a ).
[0022] refer to Figure 1(a) with 1(b) , the connector includes contacts 30 with jumpers 14 and a hybrid PCB 10 where the plug 20 is mated with the connector. Plug 20 may be a modula...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com